M1AFS1500-1FGG484I vs M1AFS1500-FGG484K Comparación

Comparación detallada lado a lado de M1AFS1500-1FGG484I por Microchip Technology y M1AFS1500-FGG484K por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
M1AFS1500-1FGG484I M1AFS1500-1FGG484I - 1.5M Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS1500-1FGG484I - 1.5M Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS1500-1FGG484I ✓ Activo
Microchip Technology
M1AFS1500-FGG484K M1AFS1500-FGG484K - 1.5M Gate Fusion FPGA, 223 I/O | Microchip

M1AFS1500-FGG484K - 1.5M Gate Fusion FPGA, 223 I/O | Microchip

M1AFS1500-FGG484K ✓ Activo

Comparación de especificaciones

Parámetro M1AFS1500-1FGG484I M1AFS1500-FGG484K
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $1,00
Manufacturer Microchip Technology (originally Microsemi Corporation) —
Family Fusion Mixed-Signal FPGA —
System Gates 1500000 gates —
Logic Cells 38400 —
Embedded Processor ARM Cortex-M1 ARM Cortex-M1
User I/O 223 —
Flash Fabric Bits 276480 bits —
Core Supply Voltage 1.5 V —
Process Technology 130 nm flash-based —
Speed Grade -1 —
Encapsulado 484-ball Fine-Pitch BGA (FGG484), 1.00 mm pitch —
Package Dimensions 23 mm x 23 mm —
Temperature Grade Industrial (-40C to +100C, I suffix) —
Tipo de montaje Surface Mount Surface Mount
Analog Blocks Configurable analog (ADC-based system monitoring) Yes (Fusion configurable analog)
Clock Management On-chip CCC clock conditioning and generation —
Configuration Memory On-chip flash (single-chip, instant-on) —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Estado RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Series — Fusion
Number of System Gates — 1500000
Total RAM Bits — 276480
Number of I/O — 223
Tensión de alimentación — 1.425 V to 1.575 V
Core Technology — 130 nm flash-based
Encapsulado / Carcasa — 484-BGA (FBGA, 23x23 mm)
Supplier Device Package — 484-FPBGA (23x23)
Programming Type — In-System Programmable (flash-based, non-volatile)
Temperatura de funcionamiento — [DATA_NEEDED: operating temperature range]
Packaging — Tray
Product Status — Active

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