M1AFS250-1FGG256I vs M1AFS250-1FG256 Vergleich

Detaillierter Direktvergleich von M1AFS250-1FGG256I von Microchip Technology und M1AFS250-1FG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ Aktiv
Microchip Technology
M1AFS250-1FG256 M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS250-1FG256 ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS250-1FGG256I M1AFS250-1FG256
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $117,83
Series M1AFS250 (Fusion) —
System Gates 250,000 gates 250000 gates
Logic Cells 6144 —
Total SRAM/Flip-Flop Bits (DigiKey listing) 36864 —
Number of I/O 114 —
Maximum System Frequency 350 MHz —
Processor Core ARM Cortex-M1 (optional ARM support, M1 variant) ARM Cortex-M1
Technology 130-nm, 7-layer metal, flash-based CMOS 130 nm flash-based
Configuration Memory Nonvolatile flash (Live at Power-Up, LAPU) —
Security 128-bit flash-based lock, AES decryption 128-bit flash lock, AES decryption
Betriebsversorgungsspannung 1.5 V —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Gehäuse / Bauform 256-LBGA (FBGA), 1.00 mm ball pitch —
Montagestil SMD/SMT —
Packaging Tray —
Mixed-Signal Features Configurable analog, flash memory blocks, clock generation and management —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Family — Fusion (M1 series, mixed-signal FPGA)
User I/O — 114
User Flash Memory — 36864 bits
Core Supply Voltage — 1.5 V
Maximum Performance — 1282.05 MHz (per FindIC spec summary)
Configuration — Flash-based, live at power-up
Gehäuse — 256-LBGA (FG256)
Montageart — Surface Mount
Analog Blocks — Integrated configurable analog (Fusion)
Clock Management — Integrated clock generation and management circuitry
Betriebstemperatur — [DATA_NEEDED: operating temperature range]

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