M1AFS250-2FGG256 vs M1AFS250-FG256 Vergleich
Detaillierter Direktvergleich von M1AFS250-2FGG256 von Microchip Technology und M1AFS250-FG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS250-2FGG256 - Fusion FPGA 250K Gates ARM M1 | Microchip
M1AFS250-2FGG256 ✓ AktivMicrochip Technology
M1AFS250-FG256 - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-FG256 ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS250-2FGG256 | M1AFS250-FG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $83,12 | $112,00 |
| Family | Fusion (M1 series) Mixed-Signal FPGA | Fusion (M1 series, ARM Cortex-M1) |
| System Gates | 250000 gates | 250000 |
| Registers (D-Flip-Flops) | 36864 | — |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based | 130 nm |
| Configuration Memory | Flash (in-system programmable, instant-on) | Flash (nonvolatile) |
| Analog Features | Configurable analog block, voltage monitoring | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| Gehäuse | 256-LBGA (FGG256) | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Speed Grade | -2 | — |
| Total RAM | [DATA_NEEDED: embedded flash memory capacity] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | RoHS Non-Compliant (contains lead) |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Manufacturer Part Number | — | M1AFS250-FG256 |
| Logic Cells | — | 6144 |
| Maximale Taktfrequenz | — | 350 MHz |
| Number of I/O | — | 114 |
| RAM Bits | — | 36864 |
| Betriebstemperaturbereich | — | 0C to +70C |
| Gehäuse / Bauform | — | 256-FBGA (256-LBGA), 1.00 mm pitch |
| Montagestil | — | SMD/SMT |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Series | — | M1AFS250 |