M1AFS250-2FGG256I vs M1AFS250-1FG256I Vergleich

Detaillierter Direktvergleich von M1AFS250-2FGG256I von Microchip Technology und M1AFS250-1FG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS250-2FGG256I M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip

M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip

M1AFS250-2FGG256I ✓ Aktiv
Microchip Technology
M1AFS250-1FG256I M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip

M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip

M1AFS250-1FG256I ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS250-2FGG256I M1AFS250-1FG256I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $83,12 $96,50
Family Actel Fusion (Mixed-Signal FPGA) —
System Gates 250000 gates 250000 gates
Registers (DFFs) 36864 —
User I/Os 114 —
Embedded Processor ARM Cortex-M1 ARM Cortex-M1 soft core
Configuration Technology Flash-based, nonvolatile —
Process Technology 130 nm, 7-layer metal CMOS —
System Performance Up to 350 MHz —
Speed Grade -2 -1
Core Supply Voltage 1.5 V 1.5 V (1.425 V to 1.575 V)
Gehäuse 256-ball FBGA (FGG256) 256-LBGA (FBGA)
Montageart Surface Mount Surface Mount
Betriebstemperatur -40C to +85C (industrial, I grade) -40C to +85C (industrial, suffix I)
Security 128-bit Flash lock, AES decryption —
Power-Up Behavior Live at Power-Up (LAPU) —
RoHS-Status Compliant (FGG = Pb-free balls) —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Series — Fusion (M1 - with ARM Cortex-M1)
D Flip-Flops (DFF) — 36864
Total I/O — 114
Configuration Type — Flash-based (live at power-up)
Analog Features — Configurable analog blocks, clock generation and management
On-chip Memory — Flash memory blocks
Package Dimensions — 17 mm x 17 mm x 1.2 mm height
Supplier Device Package — 256-LBGA
Total RAM — [DATA_NEEDED: Total RAM bits]
Embedded Block RAM (eSRAM) — [DATA_NEEDED: eSRAM size]

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