M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
Teilenummer: M1AFS250-1FG256I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $121 | $12.100,00 |
| 500 | $109 | $54.500,00 |
| 1.000 | $96.5 | $96.500,00 |
M1AFS250-1FG256I Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, programmable interconnects, and I/O cells that the designer configures after manufacturing. Unlike ASICs, FPGAs are reprogrammable in the field, making them the flexible middle tier of the digital hierarchy: gates -> FPGAs -> structured ASICs -> hardwired ASICs. The Fusion family extends this concept by being a mixed-signal FPGA, integrating configurable analog blocks, flash memory, and clock management on a monolithic die.
The M1 prefix denotes Fusion devices that embed an ARM Cortex-M1 soft processor, allowing a single chip to host both microcontroller-class firmware and custom hardware acceleration. Flash-based configuration means the device is live at power-up, requires no external configuration PROM, and provides inherent tamper resistance and instant-on behavior prized in secure and aerospace-adjacent designs.
Architecturally, Fusion combines flash-based programmable logic fabric, large flash memory blocks, configurable analog peripherals (voltage monitors, temperature sensors, current monitoring through integrated circuitry), and comprehensive on-chip clock generation and management circuitry. The -1 speed grade and industrial temperature rating (suffix I) target extended-temperature industrial and communications equipment.
Typical applications include industrial automation controllers, mixed-signal system consolidation, embedded motor control with the Cortex-M1, power-supply supervision, and communications line-card logic.
Designers should budget the 1.5V core rail with the 1.425V-to-1.575V tolerance in mind and reserve flash-based configuration for designs that must boot instantly without external boot devices.
This page synthesizes distributor pricing tiers, drop-in same-package alternatives across the Fusion family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für M1AFS250-1FG256I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M1AFS250-1FG256I (gleiche Bauform und Footprint) – abweichend in Package, RoHS Status, System Gates, Configuration Memory, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M1AFS250-1FGG256I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →M1AFS250-2FG256I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →M1AFS250-2FGG256I
✅ Drop-In✓ Auf Lager
$83.12 / Stück
Datenblatt ansehen →M1AFS250-FG256I
✅ Drop-In✓ Auf Lager
$33.1 / Stück
Datenblatt ansehen →M1AFS250-FGG256I
✅ Drop-In✓ Auf Lager
$49.5 / Stück
Datenblatt ansehen →M1AFS250-FGG256
✅ Drop-In✓ Auf Lager
$88 / Stück
Datenblatt ansehen →M1AFS250-FG256
✅ Drop-In✓ Auf Lager
$112 / Stück
Datenblatt ansehen →M1AFS250-1FG256I Grenzwerte & elektrische Eigenschaften
| Series | Fusion (M1 - with ARM Cortex-M1) |
| System Gates | 250000 gates |
| D Flip-Flops (DFF) | 36864 |
| Total I/O | 114 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Configuration Type | Flash-based (live at power-up) |
| Embedded Processor | ARM Cortex-M1 soft core |
| Analog Features | Configurable analog blocks, clock generation and management |
| On-chip Memory | Flash memory blocks |
| Betriebstemperatur | -40C to +85C (industrial, suffix I) |
| Speed Grade | -1 |
| Gehäuse | 256-LBGA (FBGA) |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height |
| Montageart | Surface Mount |
| Supplier Device Package | 256-LBGA |
M1AFS250-1FG256I 256-lbga Pinbelegungsleitfaden
Pinbelegung für M1AFS250-1FG256I (256-lbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M1AFS250-1FG256I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M1AFS250-1FG256I ist geeignet für 6 Anwendungs: Industrial Automation Controllers, Mixed-Signal System Consolidation, Embedded Motor Control, Power Supply Supervision and Management, Communications Line Cards, Secure and Instant-On Embedded Systems.
Industrial Automation Controllers
The M1AFS250-1FG256I suits industrial programmable logic controllers and I/O modules because its -40C to +85C industrial rating, flash-based live-at-power-up fabric, and integrated ARM Cortex-M1 let one chip handle both deterministic control firmware and custom interface logic. Fusion's configurable analog blocks monitor supply voltage and die temperature, replacing discrete supervisor ICs and reducing BOM count on the controller board. Placed as the system controller in a 24V-backed cabinet, the 1.5V core (1.425V-1.575V) is fed by a point-of-load buck regulator while the fabric manages fieldbus interfaces and PWM generation. Because configuration resides in on-chip flash, the controller begins executing within microseconds of power-up - important for safety interlocks that must validate machine state immediately, and unlike SRAM FPGAs there is no external boot flash to corrupt or be attacked.
Empfohlen
Mixed-Signal System Consolidation
Fusion's defining advantage is monolithic integration of configurable analog (voltage and temperature monitoring, current sensing support), flash memory, clock management, and digital fabric. The M1AFS250-1FG256I fits board-level consolidation projects where discrete ADCs, supervisor ICs, POR circuits, and clock generators are replaced by one 17 mm x 17 mm 256-ball device. In a typical line-card or appliance control board, the analog blocks continuously monitor multiple rails while the Cortex-M1 runs housekeeping firmware and the fabric implements glue logic - functions that previously required 6-10 separate components. The 114 user I/O provide ample connectivity between the consolidated domains, and the 1.5V core keeps dynamic power low compared to older 2.5V-core FPGA architectures, simplifying thermal design in sealed enclosures.
Empfohlen
Embedded Motor Control
With the ARM Cortex-M1 soft processor and fabric-level PWM generation, the M1AFS250-1FG256I implements multi-axis motor controllers in a single flash-based device. The Cortex-M1 executes the control loop (FOC or trapezoidal commutation) while the fabric produces deadband-controlled PWM with sub-nanosecond-adjustable timing, samples current-shunt signals through external comparators into Fusion's analog monitor inputs, and handles encoder quadrature decoding. Live-at-power-up configuration ensures PWM outputs are gated to a safe state from the first microsecond - no external configuration load time that could leave bridges floating. The industrial -40C to +85C range and 1.5V core tolerance of 1.425V-1.575V match the electrical environment of factory drives, and flash fabric immunity to configuration upset adds robustness in high-EMI inverter cabinets.
Empfohlen
Power Supply Supervision and Management
Fusion's integrated analog subsystem makes the M1AFS250-1FG256I a natural board-level power supervisor: its analog blocks digitize multiple voltage rails and die temperature, while flash fabric implements programmable threshold logic, sequencing state machines, and fault logging that discrete supervisor ICs cannot customize. In a backplane design, the device monitors 5V/3.3V/1.5V rails against software-defined windows, sequences downstream regulators via fabric-driven enables, and signals faults over SPI or I2C implemented in the 114 available I/O. Unlike fixed-function sequencers, thresholds and timing are firmware-revisable in the field because configuration is flash-based. The 1.5V (1.425V-1.575V) core draw keeps the supervisor's own consumption modest, and the industrial temperature rating supports telecom and outdoor power shelves operating at -40C to +85C ambient.
Empfohlen
Communications Line Cards
Telecom and industrial networking line cards need deterministic logic that is running before the management processor completes boot - exactly the property flash-based configuration gives the M1AFS250-1FG256I. The device handles backplane interface glue logic, LED status multiplexing, hot-swap event handling, and JTAG boundary-scan at the board level, while the Cortex-M1 can run a lightweight management agent. On-chip clock management circuitry conditions the card's reference oscillators, and the analog blocks watch local rail health, feeding status to the shelf manager. The industrial -40C to +85C rating and 1.5V core suit both outdoor plant equipment and conditioned central-office racks, and the compact 17 mm x 17 mm 256-ball LBGA preserves precious board area on high-density cards where 114 I/O must reach two board edges.
Empfohlen
Secure and Instant-On Embedded Systems
Flash-based FPGAs are preferred in security-sensitive and instant-on systems because the bitstream never leaves the chip: there is no external configuration PROM to clone, sniff, or corrupt. The M1AFS250-1FG256I fits secure industrial gateways, encrypted storage controllers, and transportation data recorders where the ARM Cortex-M1 boots and authenticates within microseconds of power-up. Fusion's flash fabric resists configuration readback, and the analog monitors detect supply-glitch attack patterns that software alone can miss. With 250K gates and 36,864 flip-flops, the fabric implements AES or SHA acceleration sized to the threat model, while 114 I/O connect tamper switches, sensors, and host interfaces. The 1.5V core (1.425V-1.575V) supports battery-backed and low-power designs, and the industrial rating covers -40C to +85C deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M1AFS250-1FG256I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M1AFS250-1FGG256I | M1AFS250-2FG256I | M1AFS250-2FGG256I | M1AFS250-FG256I | M1AFS250-FGG256 |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (17 x 17 mm) | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250000 | 250000 | 250000 | 250000 | 250000 | 250000 |
| User I/O | 114 | 114 | 114 | 114 | 114 | 114 |
| Speed Grade | -1 | -1 | -2 (faster) | -2 (faster) | standard (no dash grade) | standard (no dash grade) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | commercial (suffix indicates 0C to +70C) |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Packaging / Compliance | FG standard solder ball | FGG green (lead-free/halogen-free) | FG standard solder ball | FGG green (lead-free/halogen-free) | FG standard solder ball | FGG green (lead-free/halogen-free) |
Wichtigste Unterscheidungsmerkmale
- Flash-based live-at-power-up configuration (vs. M1AFS250-FGG256)
- Integrated ARM Cortex-M1 plus analog in one die (vs. Xilinx Artix-7 (functional alternative only, no pin compatibility))
- Speed-grade headroom on same footprint (vs. M1AFS250-2FG256I)
Designhinweise
Regulate the 1.5V core rail to within 1.425V-1.575V under all transients. Fusion 250K devices draw dynamic core current proportional to switching activity; size the point-of-load buck converter for worst-case utilization identified in Libero power analysis, and verify startup ramp behavior against the datasheet power-up specification so flash configuration completes reliably. Because the fabric is live at power-up, also sequence I/O bank supplies so inputs to external devices are not driven before those devices are powered.
The 256-ball LBGA is 1.2 mm tall with fine ball pitch; use NSMD pad geometry per the Microchip package outline, follow a standard BGA escape-routing fanout, and allocate solid reference planes under the ball field for signal integrity. The exposed array benefits from X-ray inspection during production qualification. Provide generous via stitching between ground planes and keep the analog monitoring inputs (used by Fusion's configurable analog blocks) routed away from high dV/dt switching nodes such as buck converter switch nets.
Do not confuse the ordering-code suffixes: 'G' changes packaging (green/lead-free) but temperature suffix changes operating range - M1AFS250-FGG256 (commercial) is NOT a substitute for the industrial-rated M1AFS250-1FG256I in -40C applications, even though the footprint is identical. Also confirm speed grade in timing closure: a -1 design that barely meets timing cannot be swapped to standard-grade stock without re-running Libero timing analysis.
Compliance-Informationen
The base FG ordering code's RoHS/lead-free status should be confirmed per lot; Microchip's FGG (green) variants in the same package are the explicitly lead-free/halogen-free options. Verify with the certificate of conformance supplied at shipment.
