M1AFS250-FGG256I vs M1AFS250-1FGG256I Vergleich
Detaillierter Direktvergleich von M1AFS250-FGG256I von Microchip Technology und M1AFS250-1FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip
M1AFS250-FGG256I ✓ AktivMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS250-FGG256I | M1AFS250-1FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $49,50 | $0,00 |
| Series | Fusion (M1AFS) | M1AFS250 (Fusion) |
| System Gates | 250K | 250,000 gates |
| D Flip-Flops / Registers | 36864 | — |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | — |
| Fabric Speed Metric | 1.0989 GHz (per distributor listing) | — |
| Process Technology | 130 nm flash-based | — |
| Configuration Memory | On-chip flash (non-volatile) | Nonvolatile flash (Live at Power-Up, LAPU) |
| Gehäuse | 256-LBGA (FGG256) | — |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | -40C to +85C (Industrial) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | Tray |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Security | — | 128-bit flash-based lock, AES decryption |
| Betriebsversorgungsspannung | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Gehäuse / Bauform | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Montagestil | — | SMD/SMT |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |