M1AFS250-FGG256I vs M1AFS250-1FGG256I Comparación
Comparación detallada lado a lado de M1AFS250-FGG256I por Microchip Technology y M1AFS250-1FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip
M1AFS250-FGG256I ✓ ActivoMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS250-FGG256I | M1AFS250-1FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $49,50 | $0,00 |
| Series | Fusion (M1AFS) | M1AFS250 (Fusion) |
| System Gates | 250K | 250,000 gates |
| D Flip-Flops / Registers | 36864 | — |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | — |
| Fabric Speed Metric | 1.0989 GHz (per distributor listing) | — |
| Process Technology | 130 nm flash-based | — |
| Configuration Memory | On-chip flash (non-volatile) | Nonvolatile flash (Live at Power-Up, LAPU) |
| Encapsulado | 256-LBGA (FGG256) | — |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | Tray |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Security | — | 128-bit flash-based lock, AES decryption |
| Tensión de alimentación de funcionamiento | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Estilo de montaje | — | SMD/SMT |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |