M1AFS600-2FG256 vs AFS600-2FG256 Vergleich

Detaillierter Direktvergleich von M1AFS600-2FG256 von Microchip Technology und AFS600-2FG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ Aktiv
Microchip Technology
AFS600-2FG256 AFS600-2FG256 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-2FG256 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-2FG256 ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS600-2FG256 AFS600-2FG256
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Series M1AFS600 (Fusion) —
System Gates 600000 gates 600000 gates
Logic Elements 110592 —
Embedded Processor ARM Cortex-M1 —
Number of I/Os 119 I/O —
Core Supply Voltage 1.5 V —
Technology 130 nm flash-based —
Gehäuse / Bauform 256-LBGA (FBGA-256) —
Montagestil SMD/SMT —
Operating Temperature - Minimum 0 C —
Operating Temperature - Maximum +70 C —
Packaging Tray —
Analog Peripherals Configurable analog block (Fusion mixed-signal) —
On-chip Memory Large flash memory blocks —
Clock Management On-chip clock generation and management (PLL) Comprehensive clock generation and management circuitry
Configuration Flash-based, live at power-up, no external config PROM required —
RoHS-Status [DATA_NEEDED: RoHS status] unknown
Maximum Operating Frequency [DATA_NEEDED: maximum fabric operating frequency] —
Programmable Logic Blocks — 13824 CLBs
Logic Family — CMOS
Process Technology — 130 nm flash-based CMOS
Metal Layers — 7 layers
Versorgungsspannung — 1.5 V
Anzahl der Pins — 256 pins
I/O Count — 119 I/O
Package Type — FBGA-256, 1.0 mm pitch
Montageart — Surface Mount
Betriebstemperatur — 0°C to 85°C (32°F to 185°F)
Junction Temperature Test — 100°C
Configuration Memory — Flash-based, nonvolatile
Power-Up Behavior — Live at Power-Up (LAPU)
Analog Resources — Configurable analog blocks
Embedded Memory — Large flash memory blocks
Product Family — Fusion mixed-signal FPGA

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