M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
Teilenummer: M1AFS600-2FG256 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $62.35 | $623,50 |
| 100 | $56.8 | $5.680,00 |
| 500 | $51.2 | $25.600,00 |
| 1.000 | $46.75 | $46.750,00 |
M1AFS600-2FG256 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer wires together after manufacturing. The M1AFS600 belongs to the Fusion family of mixed-signal FPGAs, which sit at the intersection of the FPGA hierarchy (FPGA -> programmable logic device -> digital IC) and analog/mixed-signal power-management ICs, because each die also integrates configurable analog peripherals, large flash memory blocks, and comprehensive clock generation and management circuitry in one monolithic device.
Key differentiating features include the hard-wired ARM Cortex-M1 processor running alongside reconfigurable fabric, which removes the need for a separate microcontroller in many designs. The flash-based fabric is live-at-power-up, immune to configuration data loss, and does not require an external configuration PROM. The Fusion analog block supports voltage, current, and temperature monitoring, enabling single-chip board-management implementations.
Architecturally, the 130nm flash process fuses each logic switch at the transistor level, yielding higher density per route than SRAM FPGAs of the same generation and lower static power. Clock generation and management circuitry on-chip provides PLL-based synthesis for the fabric and the Cortex-M1 subsystem.
Typical applications include board-level power management and smart battery charging, motor control, clock generation and distribution, and embedded systems where an ARM microcontroller plus programmable logic must coexist in one 256-ball package. The commercial 0C to +70C operating range of the -2FG256 grade targets office and indoor industrial equipment.
A key design consideration: confirm I/O bank voltage support for your 3.3V/2.5V/1.8V signaling environment and budget board space for the 256-ball footprint, since the FG256 ballout is not shared with smaller PQG208 Fusion variants.
This page synthesizes distributor inventory data, family cross-references, and practical design notes not found in the manufacturer datasheet, with verified data as of 2026-09-02.
Drop-in-Alternativen für M1AFS600-2FG256 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M1AFS600-2FG256 (gleiche Bauform und Footprint) – abweichend in Process Technology, System Gates, Package, Family, Package / Case.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M1AFS600-FG256
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$22 / Stück
Datenblatt ansehen →M7AFS600-FG256
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$198.75 / Stück
Datenblatt ansehen →M7AFS600-FGG256
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$232.4 / Stück
Datenblatt ansehen →M1AFS1500-2FGG256
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$124.5 / Stück
Datenblatt ansehen →M1AFS250-2FG256I
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3P600-2FG256
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$57.43 / Stück
Datenblatt ansehen →M1AFS600-2FG256 Grenzwerte & elektrische Eigenschaften
| Series | M1AFS600 (Fusion) |
| System Gates | 600000 gates |
| Logic Elements | 110592 |
| Embedded Processor | ARM Cortex-M1 |
| Number of I/Os | 119 I/O |
| Core Supply Voltage | 1.5 V |
| Technology | 130 nm flash-based |
| Gehäuse / Bauform | 256-LBGA (FBGA-256) |
| Montagestil | SMD/SMT |
| Operating Temperature - Minimum | 0 C |
| Operating Temperature - Maximum | +70 C |
| Packaging | Tray |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) |
| On-chip Memory | Large flash memory blocks |
| Clock Management | On-chip clock generation and management (PLL) |
| Configuration | Flash-based, live at power-up, no external config PROM required |
M1AFS600-2FG256 256-lbga (fbga-256) Pinbelegungsleitfaden
Pinbelegung für M1AFS600-2FG256 (256-lbga (fbga-256)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M1AFS600-2FG256.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M1AFS600-2FG256 ist geeignet für 6 Anwendungs: Board Power Management and Monitoring, Embedded ARM Control Systems, Motor Control, Smart Battery Charging Systems, Clock Generation and Management, Industrial I/O and Glue Logic Consolidation.
Board Power Management and Monitoring
Fusion mixed-signal FPGAs were created specifically for power management: the configurable analog block measures multiple voltage, current, and temperature channels on-board, while the flash fabric implements sequencing and fault-response state machines. The M1AFS600-2FG256 replaces discrete supervisory ICs, ADCs, and glue logic in a single 256-ball device, cutting BOM count and board area. A design monitoring four rails at 12-bit resolution can trigger controlled shutdown or power-good signaling within microseconds. Because the fabric is live at power-up, monitoring begins before a soft CPU even boots - a key advantage over processor-based supervisors.
Empfohlen
Embedded ARM Control Systems
The hard ARM Cortex-M1 processor makes the M1AFS600-2FG256 a single-chip embedded controller: firmware runs on the deterministic Cortex-M1 while custom peripherals - PWM engines, UARTs, encoders - are instantiated in the surrounding 110592-element fabric. This architecture suits industrial equipment that historically paired a microcontroller with a small CPLD. The flash-based fabric boots instantly, so the ARM core begins executing at power-up without external configuration memory. With 119 user I/Os in the FG256 package, one device can replace an MCU plus a mid-density FPGA, reducing procurement to a single line item.
Empfohlen
Motor Control
Motor control demands precise PWM generation, fast current sensing, and deterministic loop closure - all areas where the M1AFS600-2FG256 excels. The fabric can implement multi-channel high-resolution PWM at hundreds of kHz while the analog block samples phase currents and heatsink temperature; the ARM Cortex-M1 runs the speed/torque control loop. According to Microchip, Fusion FPGAs target motor control among their primary application areas. Implementing commutation logic in hardware removes software latency jitter, and flash fabrics tolerate the electrically noisy environment around power stages better than SRAM-based parts.
Empfohlen
Smart Battery Charging Systems
Smart battery chargers require charge-profile state machines, voltage/current telemetry, and host communication - the exact combination the Fusion M1AFS600-2FG256 integrates. The analog block digitizes pack voltage, charge current, and cell temperature, the fabric implements CC/CV charge profiles and safety interlocks in deterministic hardware, and the ARM Cortex-M1 handles SMBus/I2C host protocols and logging to the on-chip flash blocks. Implementing safety logic in hardware rather than firmware provides fail-safe behavior independent of software state, which is valuable for charge-termination and over-temperature protection decisions.
Empfohlen
Clock Generation and Management
Fusion FPGAs include comprehensive on-chip clock generation and management circuitry, and the M1AFS600-2FG256 extends this with fabric-implemented frequency synthesizers, jitter cleaners, and distribution logic. A single device can generate multiple system clocks from one reference, monitor clock presence via the analog block, and implement hitless switchover between redundant references. The 130nm flash fabric provides deterministic routing delays, useful for phase-aligned clock output banks. With 119 I/Os, one FG256 package can service clock distribution for a full backplane while the ARM core manages configuration over I2C.
Empfohlen
Industrial I/O and Glue Logic Consolidation
Legacy industrial boards often combine a microprocessor, several PAL/GAL devices, counters, and level-shift buffers. The M1AFS600-2FG256 consolidates all of this into one flash-based, live-at-power-up device: the fabric absorbs address decoding, interrupt control, and timing logic while the ARM core replaces the original MCU. The commercial 0C to +70C grade fits indoor factory environments, and the FG256 1.0mm ball pitch simplifies rework compared with finer-pitch BGA packages. Migration path: if obsolescence strikes, pin-compatible M7AFS600 and M1AFS1500 FG256 variants keep the same PCB footprint.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M1AFS600-2FG256 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M1AFS600-FG256 | M7AFS600-FG256 | M1AFS1500-2FGG256 | A3P600-2FG256 |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi Fusion) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (ProASIC3) |
| Package | 256-LBGA (FG256) | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same |
| System Gates | 600000 gates | 600000 gates | 600000 gates | 1500000 gates | 600000 gates |
| Embedded Processor | ARM Cortex-M1 (hard core) | ARM Cortex-M1 (hard core) | ARM Cortex-M1 (hard core) | ARM Cortex-M1 (hard core) | None (soft CPU in fabric only) |
| Configurable Analog Block | Yes (Fusion analog) | Yes (Fusion analog) | Yes (Fusion analog) | Yes (Fusion analog) | No |
| Speed Grade | -2 (fast) | Standard (slower than -2) | Standard M7 grade | -2 | -2 |
| Configuration Type | Flash (live at power-up) | Flash (live at power-up) | Flash (live at power-up) | Flash (live at power-up) | Flash (live at power-up) |
Wichtigste Unterscheidungsmerkmale
- Hard ARM Cortex-M1 processor on die (vs. A3P600-2FG256)
- Integrated configurable analog block (vs. A3P600-2FG256)
- Fast -2 speed grade (vs. M1AFS600-FG256)
- Lower cost and same footprint vs larger die (vs. M1AFS1500-2FGG256)
- Commercial temperature optimizes cost (vs. M1AFS250-2FG256I)
Designhinweise
The M1AFS600-2FG256 requires a 1.5V core rail plus I/O bank supplies. Sequence the core before or simultaneously with I/O supplies and add bulk plus 0.1uF decoupling at each VCC ball pair of the FG256 grid; with 256 balls, distribute decoupling across the array rather than clustering at one corner. Verify startup transient current of the flash fabric in the Fusion power-play data before sizing the 1.5V regulator - hot-configuration can briefly spike above static draw.
The 256-ball LBGA uses a 1.0mm ball pitch, allowing via-in-pad with 0.3mm drills and dogbone or direct via escape on 4+ layer boards. Dedicate at least one complete internal layer to a solid ground plane under the die; the Fusion analog block shares the die with switching fabric logic, so a clean return path directly affects ADC measurement accuracy. Do not route fast signals under the package center where the analog balls sit.
The commercial 0C to +70C grade is the most common selection error: outdoor, automotive-adjacent, or fanless enclosures routinely exceed 70C ambient near hot components. If in doubt, select an -I industrial variant or the M7AFS600 family and re-run timing at the correct temperature corner in Libero SoC. Also remember the -2 grade timing does not carry across the M1 to M7 migration - re-run static timing analysis after any die change, even pin-compatible ones.
With 119 user I/Os on a 1.0mm-pitch BGA, simultaneous switching noise is the primary signal-integrity risk. Group switching outputs by bank, spread high-drive outputs across banks, and reference them to solid planes. Match bank VCCI to your signaling standard (3.3V LVCMOS for most board-level glue, 2.5V/1.8V for memory interfaces) and keep stub lengths under 10mm for signals above 100MHz.
Compliance-Informationen
Compliance status not stated in the provided distributor listings. Microchip FGG (lead-free) suffix variants exist in the family; verify RoHS/REACH on the official Microchip product page for this exact ordering code.
