M2GL090-FG676 vs M2GL090T-FG676 Vergleich

Detaillierter Direktvergleich von M2GL090-FG676 von Microchip Technology und M2GL090T-FG676 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M2GL090-FG676 M2GL090-FG676 - 86K IGLOO2 FPGA, 1.2V, 676-FBGA | Microchip

M2GL090-FG676 - 86K IGLOO2 FPGA, 1.2V, 676-FBGA | Microchip

M2GL090-FG676 ✓ Aktiv
Microchip Technology
M2GL090T-FG676 M2GL090T-FG676 - 86K LEs, 425 I/O FPGA | Microchip | Industrial

M2GL090T-FG676 - 86K LEs, 425 I/O FPGA | Microchip | Industrial

M2GL090T-FG676 ✓ Aktiv

Spezifikationsvergleich

Parameter M2GL090-FG676 M2GL090T-FG676
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type IGLOO2 low-density FPGA IGLOO 2 Low-Density FPGA
Logic Cells 86,316 cells —
Configuration Memory 2,648,064 bits Embedded flash
I/O Count 425 I/O —
Versorgungsspannung 1.2 V —
Gehäuse 676-pin FBGA 676-pin FBGA
Device Family IGLOO2 IGLOO 2
FPGA Type Field-programmable gate array —
Programmable Logic FPGA programmable logic fabric —
Embedded Memory IGLOO2 FPGA embedded memory resources —
Montageart Surface-mount FBGA —
Manufacturer Product Status In Production —
General-Purpose Application Secure connectivity —
Betriebstemperatur [DATA_NEEDED: operating temperature range] —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
AEC-Q100 Qualification [DATA_NEEDED: automotive qualification status] [DATA_NEEDED: AEC-Q100 qualification]
Lead-Free Status [DATA_NEEDED: lead-free status] —
Logic Elements — 86K LEs
Total FPGA Cells — 86,316 cells
User I/O Count — 425 I/O
Core Voltage Classification — 1.2 V
Package Type — 676-BGA
Programming Technology — Non-volatile flash configuration
Packaging Type — Tray
Application Category — General-purpose FPGA
Primary Functions — Bridging, I/O expansion and conversion, system management, secure connectivity
Maximale Taktfrequenz — [DATA_NEEDED: maximum clock frequency]
Betriebstemperaturbereich — [DATA_NEEDED: operating temperature range]
Supply Voltage Range — [DATA_NEEDED: supply voltage range]
Memory Resources — [DATA_NEEDED: embedded memory resources]
Package Dimensions — [DATA_NEEDED: FBGA package dimensions]

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