M2GL090-FG676 vs M2GL090T-FG676 Сравнение

Подробное сравнение бок о бок M2GL090-FG676 от Microchip Technology и M2GL090T-FG676 от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.

Microchip Technology
M2GL090-FG676 M2GL090-FG676 - 86K IGLOO2 FPGA, 1.2V, 676-FBGA | Microchip

M2GL090-FG676 - 86K IGLOO2 FPGA, 1.2V, 676-FBGA | Microchip

M2GL090-FG676 ✓ Активен
Microchip Technology
M2GL090T-FG676 M2GL090T-FG676 - 86K LEs, 425 I/O FPGA | Microchip | Industrial

M2GL090T-FG676 - 86K LEs, 425 I/O FPGA | Microchip | Industrial

M2GL090T-FG676 ✓ Активен

Сравнение характеристик

Параметр M2GL090-FG676 M2GL090T-FG676
Бренд Microchip Technology Microchip Technology
Категория FPGA & CPLD FPGA & CPLD
Статус жизненного цикла Активен Активен
Device Type IGLOO2 low-density FPGA IGLOO 2 Low-Density FPGA
Logic Cells 86,316 cells —
Configuration Memory 2,648,064 bits Embedded flash
I/O Count 425 I/O —
Напряжение питания 1.2 V —
Корпус 676-pin FBGA 676-pin FBGA
Device Family IGLOO2 IGLOO 2
FPGA Type Field-programmable gate array —
Programmable Logic FPGA programmable logic fabric —
Embedded Memory IGLOO2 FPGA embedded memory resources —
Тип монтажа Surface-mount FBGA —
Manufacturer Product Status In Production —
General-Purpose Application Secure connectivity —
Рабочая температура [DATA_NEEDED: operating temperature range] —
Статус RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
AEC-Q100 Qualification [DATA_NEEDED: automotive qualification status] [DATA_NEEDED: AEC-Q100 qualification]
Lead-Free Status [DATA_NEEDED: lead-free status] —
Logic Elements — 86K LEs
Total FPGA Cells — 86,316 cells
User I/O Count — 425 I/O
Core Voltage Classification — 1.2 V
Package Type — 676-BGA
Programming Technology — Non-volatile flash configuration
Packaging Type — Tray
Application Category — General-purpose FPGA
Primary Functions — Bridging, I/O expansion and conversion, system management, secure connectivity
Максимальная тактовая частота — [DATA_NEEDED: maximum clock frequency]
Диапазон рабочих температур — [DATA_NEEDED: operating temperature range]
Supply Voltage Range — [DATA_NEEDED: supply voltage range]
Memory Resources — [DATA_NEEDED: embedded memory resources]
Package Dimensions — [DATA_NEEDED: FBGA package dimensions]

Даташиты & ресурсы

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