M7AFS600-1FGG256 vs M7AFS600-1FGG484I Vergleich

Detaillierter Direktvergleich von M7AFS600-1FGG256 von Microchip Technology und M7AFS600-1FGG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M7AFS600-1FGG256 M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-1FGG256 Nrnd
Microchip Technology
M7AFS600-1FGG484I M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip

M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip

M7AFS600-1FGG484I ✓ Aktiv

Spezifikationsvergleich

Parameter M7AFS600-1FGG256 M7AFS600-1FGG484I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $92,00 $228,00
Family Fusion (Mixed-Signal FPGA) —
System Gates 600K 600000
Fabric Elements (Registers) 110592 —
Embedded Processor 32-bit ARM CoreMP7 (hard core) ARM CoreMP7
Speed Grade -1 1 (M7, fastest family grade)
Process Technology 130 nm flash 130 nm
Core Supply Voltage 1.5 V —
Gehäuse 256-LBGA (FPBGA-256, 17x17 mm) —
Montageart Surface Mount —
Configuration Flash-based, nonvolatile, live at power-up —
Betriebstemperatur 0C to +70C (commercial) -40C to +85C
Maximum Frequency [DATA_NEEDED: maximum fabric/system frequency] —
Number of I/O [DATA_NEEDED: user I/O count for FGG256] —
Analog Peripherals [DATA_NEEDED: ADC channel count and resolution] —
On-chip RTC / POR [DATA_NEEDED: RTC/POR availability details] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] ROHS3 Compliant
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Series — Fusion (M7AFS600)
Number of I/Os — 172
Total RAM Bits — 110592
Versorgungsspannung — 1.5 V
Supply Voltage Range — 1.425 V to 1.575 V
Maximum Operating Frequency — 1282.05 MHz
Gehäuse / Bauform — 484-BGA (FBGA)
Supplier Device Package — 484-FPBGA (23x23)
Montagestil — SMD/SMT
Packaging — Tray
Programmable Type — Flash-based, In-System Programmable
Manufacturer Lead Time — 16 weeks
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]
Number of Logic Cells — [DATA_NEEDED: logic cell count]

Datenblätter & Ressourcen

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