M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
Teilenummer: M7AFS600-1FGG256 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118 | $11.800,00 |
| 500 | $104 | $52.000,00 |
| 1.000 | $92 | $92.000,00 |
M7AFS600-1FGG256 Übersicht
A mixed-signal FPGA is a field-programmable gate array that integrates configurable digital logic fabric with analog peripherals on a single die. Within the programmable logic hierarchy (FPGA -> programmable SoC -> programmable logic device -> semiconductor), Fusion devices from Actel, later Microsemi and now Microchip Technology, were pioneering because they combined flash-based fabric with ADC, RTC, and POR analog blocks, removing external analog components from many embedded designs.
Key features of the M7AFS600 include the hard-wired ARM CoreMP7 processor running at high frequency from the 130nm flash process, flash-based nonvolatile configuration (no external boot PROM required and instant-on operation), and integration of analog peripherals such as a multi-channel ADC and programmable low-dropout regulators. The -1 speed grade and commercial temperature variant (0C to +70C) make this suffix cost-optimized for standard embedded applications.
Architecturally, the Fusion family is built on Actel's proven flash-based ProASIC3 fabric augmented with analog I/O, giving designers single-chip system management, power sequencing supervision, and fan control alongside custom logic. The 256-ball FGG256 footprint with 17x17 mm ball grid array suits two-layer routing of high-logic-density designs in compact form factors.
Typical applications include embedded system controllers, power-supply and board-level health monitoring, industrial automation interfaces, and portable instrumentation where one chip must replace an MCU plus supervisor plus analog front end.
Design consideration: flash-based Fusion fabric is live-at-power-up; verify power-rail sequencing for the 1.5V core and 3.3V I/O domains, and confirm the ARM CoreMP7 clock plan against the -1 speed grade timing derating.
This page synthesizes distributor availability from Mouser, DigiKey, Octopart, and LCSC, drop-in alternatives from the same Microchip Fusion/ProASIC3 families, and practical design guidance not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für M7AFS600-1FGG256 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M7AFS600-1FGG256 (gleiche Bauform und Footprint) – abweichend in Process Technology, Family, Operating Temperature, Package, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M7AFS600-FGG256
✅ Drop-In✓ Auf Lager
$232.4 / Stück
Datenblatt ansehen →M7AFS600-FG256
✅ Drop-In✓ Auf Lager
$198.75 / Stück
Datenblatt ansehen →M7AFS600-FG256I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →M7AFS600-1FGG484I
✅ Drop-In✓ Auf Lager
$228 / Stück
Datenblatt ansehen →M1AFS600-FG256
✅ Drop-In✓ Auf Lager
$22 / Stück
Datenblatt ansehen →A3P600-1FG256I
✅ Drop-In✓ Auf Lager
$41.8 / Stück
Datenblatt ansehen →A3P600-1FG256
✅ Drop-In✓ Auf Lager
$51.28 / Stück
Datenblatt ansehen →M7AFS600-1FGG256 Grenzwerte & elektrische Eigenschaften
| Family | Fusion (Mixed-Signal FPGA) |
| System Gates | 600K |
| Fabric Elements (Registers) | 110592 |
| Embedded Processor | 32-bit ARM CoreMP7 (hard core) |
| Speed Grade | -1 |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Gehäuse | 256-LBGA (FPBGA-256, 17x17 mm) |
| Montageart | Surface Mount |
| Configuration | Flash-based, nonvolatile, live at power-up |
| Betriebstemperatur | 0C to +70C (commercial) |
M7AFS600-1FGG256 256-lbga (fpbga-256, 17x17 mm) Pinbelegungsleitfaden
Pinbelegung für M7AFS600-1FGG256 (256-lbga (fpbga-256, 17x17 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M7AFS600-1FGG256.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M7AFS600-1FGG256 ist geeignet für 6 Anwendungs: Embedded System Controller, Power Supply and Board Health Monitoring, Industrial Automation Interfaces, Portable Instrumentation, Networking and Line-Card Control, Legacy Design Sustainment.
Embedded System Controller
The M7AFS600-1FGG256 consolidates an MCU, programmable logic, and power-supply supervision into one chip, which is why it fits board-level embedded system control. The hard ARM CoreMP7 runs the firmware while 110592 fabric registers implement custom interfaces, state machines, and glue logic that a standalone MCU cannot serve. Because the fabric is flash-based, the controller is live within microseconds of power application - no boot delay from an external configuration device. In a typical topology the CoreMP7 executes control loops over an AMBA bus while fabric logic drives UART, SPI, and GPIO to sensors and actuators, and the Fusion analog block supervises multiple supply rails via the on-chip ADC, enabling one 17x17 mm BGA to replace a three-chip solution.
Empfohlen
Power Supply and Board Health Monitoring
Fusion was architected specifically for power-system management: the analog block provides a multi-channel ADC, RTC, and monitor pins that observe voltage rails, temperature, and fan speeds, making the M7AFS600-1FGG256 ideal for board health monitoring. The 1.5V-core, flash-based device reads rail voltages through the on-chip ADC, compares them against thresholds in fabric logic, and asserts alarms or sequenced shutdown via dedicated I/O - all without an external analog front end. Because configuration is nonvolatile, monitoring starts at power-up before any processor boot completes, catching early brown-out events. Designers typically allocate a small fabric state machine for trip-point latching and use the CoreMP7 for logging over UART, achieving sub-millisecond fault response in server, storage, and telecom shelf hardware.
Empfohlen
Industrial Automation Interfaces
Industrial I/O modules, motor-control panels, and PLC daughter cards benefit from the M7AFS600-1FGG256's mix of deterministic fabric logic and embedded processing. The 600K-gate fabric implements multiple protocol interfaces (SPI, UART, bit-banged fieldbus framing) in parallel, while the ARM CoreMP7 handles higher-level communication stacks - a partition that a single MCU cannot achieve at this integration level. Flash-based fabric survives industrial power cycling without reconfiguration and provides instant-on outputs, important for safety interlocks. The commercial 0C to +70C rating of this suffix suits enclosed control cabinets; for unconditioned factory-floor environments select the -I industrial variant. Integration of the analog monitor block also allows the same chip to track cabinet temperature and supply rails, reducing discrete supervisor count.
Empfohlen
Portable Instrumentation
Handheld and bench instruments need logic density, processing, and low standby complexity in a compact footprint - the 17x17 mm FPBGA-256 M7AFS600-1FGG256 delivers all three. The instant-on flash fabric lets the instrument's user interface and safety interlocks be active the moment batteries connect, while the CoreMP7 runs the measurement application. The Fusion ADC and RTC support time-stamped logging of probe or sensor inputs without a separate real-time clock chip. Because no external configuration PROM is needed, the BOM stays small enough for compact two-sided boards. Designers should budget the 1.5V core regulator efficiency for battery life and verify the commercial temperature range against the instrument's specified operating envelope before finalizing this suffix.
Empfohlen
Networking and Line-Card Control
Telecom and datacom line cards use the M7AFS600-1FGG256 as the shelf-management and hot-swap control device. The fabric implements custom backplane signaling and LED/gearbox interfaces at deterministic latency, while the CoreMP7 runs IPMI-style management firmware over UART or I2C to the shelf controller. The analog monitor block supervises the numerous rails typical of line cards, and nonvolatile configuration means the card asserts management presence immediately at insertion - a requirement for controlled hot-swap sequencing. The 600K-gate capacity comfortably hosts multiple redundant interfaces. The -1 speed grade is sufficient because line-card management logic rarely stresses fabric timing; verify only high-speed interface constraints in Libero timing reports.
Empfohlen
Legacy Design Sustainment
Many deployed systems - medical devices, test equipment, industrial controllers - were built around Actel Fusion and now face component sourcing risk. The M7AFS600-1FGG256 and its pin-compatible siblings (M7AFS600-FGG256, M7AFS600-FG256I) allow sustained production without PCB re-spin because all share the 256-ball FGG256 footprint and the same die. An existing design bitstream can typically be reused after speed-grade and temperature-range verification. Distributors such as Micro-Semiconductor reported 637 pcs in stock as of the 2026-09 snapshot, and Octopart aggregates 5 supply sources, so lifecycle-risk buyers should secure last-time-buy quantities while coordinating a longer-term migration path to Microchip SmartFusion2 for future designs.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M7AFS600-1FGG256 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M7AFS600-FGG256 | M7AFS600-FG256I | M1AFS600-FG256 | A3P600-1FG256I |
|---|---|---|---|---|---|
| Package | FPBGA-256 (17x17 mm) | FPBGA-256 - same | FPBGA-256 - same | FPBGA-256 - same | FBGA-256 - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 1M-class AFS600 | 600K |
| Embedded Processor | ARM CoreMP7 (hard) | ARM CoreMP7 (hard) | ARM CoreMP7 (hard) | ARM CoreMP7 (hard) | None (soft cores only) |
| Analog Peripherals | Yes (Fusion ADC/RTC/POR) | Yes | Yes | Yes | No |
| Configuration | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile | Flash, nonvolatile |
| Process Technology | 130 nm flash | 130 nm flash | 130 nm flash | 130 nm flash | 130 nm flash |
Wichtigste Unterscheidungsmerkmale
- Hard ARM CoreMP7 processor integrated on-die (vs. A3P600-1FG256I)
- Analog peripherals (ADC, RTC, POR) on-chip (vs. A3P600-1FG256)
- Cost-optimized commercial suffix (vs. M7AFS600-FG256I)
Designhinweise
The M7AFS600 requires a 1.5V core supply plus 3.3V I/O/auxiliary rails. Plan power-up sequencing carefully: although the flash fabric is live at power-up, Microchip documentation specifies rail sequencing constraints for Fusion devices to avoid latch-up on the 130nm process. Use a supervisor or the Fusion's own analog POR block to gate downstream loads. Estimated: a 600K-gate design drawing tens of mA on the core rail is well within a small buck converter's capability; budget I/O current separately per bank.
A 17x17 mm 256-ball BGA dissipates heat primarily through the ball array into the PCB. For the -1 speed grade at commercial temperatures, typical Fusion designs of moderate utilization rarely need heatsinking, but perform a junction-temperature estimate using the package theta-JA from the manufacturer datasheet for your layer stack (4-layer vs 2-layer changes results substantially). Keep high-activity fabric regions distributed rather than clustered to avoid localized hot spots, and verify TC against the 0C to +70C ambient rating of this suffix.
Three frequent mistakes with Fusion designs: (1) treating this as an SRAM FPGA and adding an unnecessary configuration flash - the fabric is nonvolatile; (2) ignoring speed-grade derating when substituting ordering codes - M7AFS600-1FGG256 (-1) is slower than -2 grades, so re-run timing closure in Microchip Libero SoC after any substitution; (3) mixing the commercial suffix into designs needing industrial temperature - order M7AFS600-FG256I instead. Also confirm JTAG programming chain voltage levels match 3.3V I/O banks.
Compliance-Informationen
Compliance data not stated in the retrieved distributor snippets; consult the Microchip product page environmental datasheet for RoHS/REACH status of this specific ordering code.
