M7AFS600-FGG256I vs AFS600-2FG256 Vergleich
Detaillierter Direktvergleich von M7AFS600-FGG256I von Microchip Technology und AFS600-2FG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ Aktiv
Spezifikationsvergleich
| Parameter | M7AFS600-FGG256I | AFS600-2FG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $197,02 |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | 600000 gates |
| User I/O | 119 | — |
| Gehäuse | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm flash-based CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | Comprehensive clock generation and management circuitry |
| Temperature Grade | Industrial (I suffix) | — |
| Betriebstemperaturbereich | -40C to +85C (industrial grade standard range) | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| MSL-Level | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Programmable Logic Blocks | — | 13824 CLBs |
| Logic Family | — | CMOS |
| Metal Layers | — | 7 layers |
| Versorgungsspannung | — | 1.5 V |
| Anzahl der Pins | — | 256 pins |
| I/O Count | — | 119 I/O |
| Package Type | — | FBGA-256, 1.0 mm pitch |
| Betriebstemperatur | — | 0°C to 85°C (32°F to 185°F) |
| Junction Temperature Test | — | 100°C |
| Configuration Memory | — | Flash-based, nonvolatile |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Resources | — | Configurable analog blocks |
| Embedded Memory | — | Large flash memory blocks |
| Product Family | — | Fusion mixed-signal FPGA |
| RoHS-Status | — | unknown |