M7AFS600-FGG256I vs AFS600-2FG256 Comparaison
Comparaison détaillée côte à côte de M7AFS600-FGG256I par Microchip Technology et AFS600-2FG256 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ Actif
Comparaison des spécifications
| Paramètre | M7AFS600-FGG256I | AFS600-2FG256 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $197,02 |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | 600000 gates |
| User I/O | 119 | — |
| Boîtier | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm flash-based CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | Comprehensive clock generation and management circuitry |
| Temperature Grade | Industrial (I suffix) | — |
| Plage de température de fonctionnement | -40C to +85C (industrial grade standard range) | — |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Niveau MSL | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Programmable Logic Blocks | — | 13824 CLBs |
| Logic Family | — | CMOS |
| Metal Layers | — | 7 layers |
| Tension d'alimentation | — | 1.5 V |
| Nombre de broches | — | 256 pins |
| I/O Count | — | 119 I/O |
| Package Type | — | FBGA-256, 1.0 mm pitch |
| Température de fonctionnement | — | 0°C to 85°C (32°F to 185°F) |
| Junction Temperature Test | — | 100°C |
| Configuration Memory | — | Flash-based, nonvolatile |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Resources | — | Configurable analog blocks |
| Embedded Memory | — | Large flash memory blocks |
| Product Family | — | Fusion mixed-signal FPGA |
| Statut RoHS | — | unknown |