M7AFS600-FGG256I vs M7AFS600-1FGG256I Vergleich

Detaillierter Direktvergleich von M7AFS600-FGG256I von Microchip Technology und M7AFS600-1FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ Aktiv
Microchip Technology
M7AFS600-1FGG256I M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I ✓ Aktiv

Spezifikationsvergleich

Parameter M7AFS600-FGG256I M7AFS600-1FGG256I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $0,00
Family Fusion Mixed-Signal FPGA Fusion (Mixed-Signal Flash FPGA)
System Gates 600K 600K
User I/O 119 —
Gehäuse 256-LBGA (FBGA), 1 mm ball pitch —
Core Voltage 1.5 V —
Process Technology 130 nm 130 nm, 7-layer metal flash-based CMOS
Maximum System Frequency 1098.9 MHz (per distributor parametric listing) —
Embedded Processor ARM CoreMP7 —
Fabric Type Flash-based, non-volatile, instant-on —
Analog Subsystem Integrated configurable analog (per Microchip Fusion family page) Integrated ADC, voltage/temperature monitors (per Fusion family datasheet)
On-chip Flash Memory Yes (large flash memory blocks, per Microchip Fusion family page) —
Clock Management Integrated clock generation and management circuitry (PLLs) —
Temperature Grade Industrial (I suffix) —
Betriebstemperaturbereich -40C to +85C (industrial grade standard range) —
Montageart Surface Mount —
Packaging Tray Tray
MSL-Level [DATA_NEEDED: MSL Level] —
Thermal Resistance (theta_JA) [DATA_NEEDED: Thermal Resistance] —
Processor Core — ARM CoreMP7
Number of I/O — 119
Betriebsversorgungsspannung — 1.5 V
Configuration Memory — Flash (nonvolatile)
System Performance — Up to 350 MHz
Speed Grade — -1
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Gehäuse / Bauform — 256-Ball FBGA (FGG256)
Montagestil — SMD/SMT
Series — M7AFS600
Live at Power-Up (LAPU) — Yes
RoHS-Status — [DATA_NEEDED: RoHS status]

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