M7AFS600-FGG256I vs M7AFS600-1FGG256I 비교
다음의 상세 나란히 비교: M7AFS600-FGG256I 제조: Microchip Technology 및 M7AFS600-1FGG256I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ 활성Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ 활성사양 비교
| 파라미터 | M7AFS600-FGG256I | M7AFS600-1FGG256I |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $0.00 | $0.00 |
| Family | Fusion Mixed-Signal FPGA | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 600K | 600K |
| User I/O | 119 | — |
| 패키지 | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm, 7-layer metal flash-based CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | — |
| Temperature Grade | Industrial (I suffix) | — |
| 동작 온도 범위 | -40C to +85C (industrial grade standard range) | — |
| 실장 유형 | Surface Mount | — |
| Packaging | Tray | Tray |
| MSL 레벨 | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Processor Core | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| 동작 공급 전압 | — | 1.5 V |
| Configuration Memory | — | Flash (nonvolatile) |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -1 |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| 패키지 / 케이스 | — | 256-Ball FBGA (FGG256) |
| 장착 스타일 | — | SMD/SMT |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| RoHS 상태 | — | [DATA_NEEDED: RoHS status] |