MAX157BCPA vs MAX157BEPA Vergleich

Detaillierter Direktvergleich von MAX157BCPA von Maxim Integrated und MAX157BEPA von Maxim Integrated. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter MAX157BCPA MAX157BEPA
Marke Maxim Integrated Maxim Integrated
Kategorie ADC/DAC ADC/DAC
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $3,10 $3,62
Auflösung 10 bit 10 bit
Number of Channels 2 2 single-ended
Abtastrate 108 ksps 108 ksps
Conversion Time 7.4 µs 7.4 us (successive approximation)
Versorgungsspannung +2.7 V to +5.25 V —
Supply Current (active at 3.6V) 3.2 mW (typ) —
Wake-Up Time 2.5 µs —
INL (max) ±1 LSB —
Architecture SAR (Successive Approximation) Successive Approximation (SAR)
Schnittstelle 3-wire SPI/QSPI/MICROWIRE-compatible serial —
Shutdown Mode Yes - auto power-down + SHDN pin —
On-Chip Clock Yes (internal oscillator) —
Gehäuse 8-pin PDIP 8-Pin DIP (PDIP-8), through-hole
Montageart Through-Hole Through-Hole
Betriebstemperatur 0°C to +70°C (commercial) -40C to +85C (industrial)
RoHS-Status Compliant (Pb-free '+' suffix versions) —
Wake-up Time — 2.5 us (from automatic power-down)
Supply Voltage (VDD) — +2.7 V to +5.25 V (single supply)
Supply Current (Active, VDD=+3.6V) — 3.2 mW typical
Supply Current (Power-Down) — uA-level standby
Input Type — Single-Ended
Data Interface — SPI / QSPI / MICROWIRE-compatible, 3-wire serial
Internal Oscillator — 4.096 MHz (on-chip)
Configuration — MUX + S/H + SAR ADC
Number of Terminals — 8
Terminal Form — Through-Hole
Package Code — DIP
Temperature Grade — Industrial

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