MC33742PEG vs MC33742PEPR2 Vergleich
Detaillierter Direktvergleich von MC33742PEG von NXP Semiconductors und MC33742PEPR2 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC33742PEG - SBC HS-CAN 2x 5V/200mA LDO SOIC-28 | NXP
MC33742PEG ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | MC33742PEG | MC33742PEPR2 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Voltage Regulators | Audio Codecs |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,05 | $3,42 |
| Product Type | System Basis Chip (SBC) with HS-CAN | System Basis Chip (SBC) with HS-CAN |
| Funktion | HS-CAN transceiver + 2x 5V LDO + wake-up + reset | — |
| Number of LDOs | 2 | — |
| LDO Output Voltage | 5.0 V (fixed) | — |
| LDO Output Current (each) | 200 mA | — |
| CAN Data Rate | up to 1 Mb/s (HS-CAN, ISO 11898) | 1 Mb/s (High-Speed CAN) |
| Wake-up Inputs | 4 | — |
| Reset Duration | 15 ms | 15 ms |
| Supply Voltage Range | 5.5 V to 27 V | 5.5 V to 27 V (5V/9V/12V/15V/18V/24V automotive battery compatibility) |
| Number of CAN Drivers/Receivers | 1 / 1 | — |
| Gehäuse | SOIC-28 | 48-QFN-EP (7x7 mm) with exposed pad |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40 C to +125 C | -40C to +125C (automotive AEC-Q100 grade 1) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |
| Number of CAN Drivers / Receivers | — | 1 / 1 |
| Integrated LDOs | — | 2 x 5.0 V / 200 mA low-dropout regulators |
| Wake-Up Inputs | — | 4 |
| Operating Modes | — | Sleep / Standby / Stop / Normal |
| Protection Features | — | Current limit, overtemperature pre-warning, thermal shutdown, watchdog, battery voltage monitor |
| Lead Free Status | — | Lead Free |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Primary Applications | — | Automotive HVAC, body control modules, instrument clusters, door/seat modules |