MC33742PEG vs MC33742PEPR2 Comparación
Comparación detallada lado a lado de MC33742PEG por NXP Semiconductors y MC33742PEPR2 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC33742PEG | MC33742PEPR2 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Voltage Regulators | Audio Codecs |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,05 | $3,42 |
| Product Type | System Basis Chip (SBC) with HS-CAN | System Basis Chip (SBC) with HS-CAN |
| Función | HS-CAN transceiver + 2x 5V LDO + wake-up + reset | — |
| Number of LDOs | 2 | — |
| LDO Output Voltage | 5.0 V (fixed) | — |
| LDO Output Current (each) | 200 mA | — |
| CAN Data Rate | up to 1 Mb/s (HS-CAN, ISO 11898) | 1 Mb/s (High-Speed CAN) |
| Wake-up Inputs | 4 | — |
| Reset Duration | 15 ms | 15 ms |
| Supply Voltage Range | 5.5 V to 27 V | 5.5 V to 27 V (5V/9V/12V/15V/18V/24V automotive battery compatibility) |
| Number of CAN Drivers/Receivers | 1 / 1 | — |
| Encapsulado | SOIC-28 | 48-QFN-EP (7x7 mm) with exposed pad |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40 C to +125 C | -40C to +125C (automotive AEC-Q100 grade 1) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |
| Number of CAN Drivers / Receivers | — | 1 / 1 |
| Integrated LDOs | — | 2 x 5.0 V / 200 mA low-dropout regulators |
| Wake-Up Inputs | — | 4 |
| Operating Modes | — | Sleep / Standby / Stop / Normal |
| Protection Features | — | Current limit, overtemperature pre-warning, thermal shutdown, watchdog, battery voltage monitor |
| Lead Free Status | — | Lead Free |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Primary Applications | — | Automotive HVAC, body control modules, instrument clusters, door/seat modules |