MC68LK332ACEH16 vs MC68LK332GCAG16 Vergleich
Detaillierter Direktvergleich von MC68LK332ACEH16 von NXP Semiconductors und MC68LK332GCAG16 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC68LK332ACEH16 - 32-bit CPU32 MCU, ROMless 132-PQFP | NXP
MC68LK332ACEH16 ✗ AbgekündigtNXP Semiconductors
MC68LK332GCAG16 - 32-Bit ColdFire MCU, ROMless, 144-LQFP | NXP
MC68LK332GCAG16 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MC68LK332ACEH16 | MC68LK332GCAG16 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $10,40 |
| Core Processor | CPU32 | — |
| Core Size | 32-Bit | — |
| Series | M683xx (MC68332 family) | — |
| Max Clock Frequency | 16.78 MHz | — |
| Program Memory Type | ROMless (external memory) | ROMless |
| SRAM | 2 KB | — |
| Peripherals | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) | — |
| Intermodule Bus | IMB (common intermodule bus) | — |
| Versorgungsspannung | 5 V | 5 V |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 132-PQFP (24.13 x 24.13 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Application Grade | Automotive | — |
| Programmable (ROM/emulation role) | Not verified - ROMless, code from external memory | — |
| Product Status | End of Life (Not For New Designs) | — |
| RoHS-Status | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| Core | — | CPU32 (M68300 / ColdFire lineage) |
| Datenbusbreite | — | 32-bit |
| Maximale Taktfrequenz | — | 16.78 MHz |
| RAM Size | — | 2 KB (2K x 8) |
| Number of I/O Lines | — | 15 |
| Oscillator Type | — | Internal |
| Gehäuse / Bauform | — | 144-LQFP (20 x 20 mm) |
| On-chip Peripherals | — | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) |
| Interconnect Bus | — | IMB (Intermodule Bus) |