MC7447AVU733NB vs MC7447AVU1000NB Vergleich
Detaillierter Direktvergleich von MC7447AVU733NB von NXP Semiconductors und MC7447AVU1000NB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC7447AVU733NB - PowerPC G4 MPU 733MHz 360-FCCBGA | NXP
MC7447AVU733NB ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MC7447AVU1000NB - 1GHz PowerPC G4 MPU 512KB L2 | NXP
MC7447AVU1000NB ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MC7447AVU733NB | MC7447AVU1000NB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $72,00 | $99,50 |
| Core Processor | PowerPC G4 (MPC74xx) | — |
| Architecture | RISC, 32-bit | — |
| Number of Cores | 1 | 1 |
| Speed (Clock Frequency) | 733 MHz | — |
| On-Chip L2 Cache | 512 KB | — |
| External Bus Width | 64-bit MPX bus | — |
| Vector Engine | AltiVec 128-bit SIMD | — |
| Process Technology | 0.13 um silicon-on-insulator (SOI) | Silicon-on-Insulator (SOI), 0.13 um |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 2.5 V | 1.8 V / 2.5 V |
| Gehäuse | 360-FCCBGA (25x25 mm) | 360-FCCBGA (Flip-Chip Ceramic BGA), 25x25 mm |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA socket or solder) |
| Co-Processor / DSP | Multimedia; SIMD (AltiVec) | — |
| Graphics Acceleration | No | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | 0C to +105C (commercial) |
| Tray Packaging | Yes (Tray) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: explicit RoHS statement] |
| Lead-Free (Pb-Free) | Yes (per datasheet A7PM PB-FREE marking) | — |
| Core Architecture | — | PowerPC G4 (MPC7447A) |
| Instruction Set | — | 32-bit PowerPC RISC |
| Core Frequency | — | 1.0 GHz |
| Bus Width | — | 64-bit external bus |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| L2 Cache | — | 512 KB on-chip |
| SIMD Engine | — | AltiVec (128-bit VMX) |
| Core Supply Voltage (Vdd) | — | 1.25 V to 1.35 V |
| Multi-Core Support | — | Single core (no SMP fabric on-package) |
| Floating Point Unit | — | Double-precision FPU + AltiVec single-precision SIMD |
| Instruction Cache | — | 32 KB (Harvard) |
| Branch Target Buffer | — | 512-entry BHT |