MC7447AVU1000NB - 1GHz PowerPC G4 MPU 512KB L2 | NXP
Teilenummer: MC7447AVU1000NB ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168.5 | $1.685,00 |
| 100 | $142 | $14.200,00 |
| 500 | $118.75 | $59.375,00 |
| 1.000 | $99.5 | $99.500,00 |
MC7447AVU1000NB Übersicht
A microprocessor (MPU) is the central execution unit of a computing system, fetching instructions, decoding them, and orchestrating arithmetic, logic, and memory operations. The MPC7447A belongs to the PowerPC G4 family - a high-performance RISC ISA lineage descended from the Power Architecture used in Apple Power Mac G4 and embedded signal-processing platforms. It sits higher in the hierarchy than a microcontroller (which integrates peripherals), and within the MPU taxonomy it is a high-end embedded/compute engine with dedicated SIMD and floating-point capability rather than a general-purpose laptop/desktop CPU with integrated northbridge logic.
Key differentiating features include the 128-bit AltiVec vector engine (VMX) for SIMD DSP-style workloads, the SOI (silicon-on-insulator) process for reduced leakage, on-die L2 cache that lets the part operate without external SRAM on the data path, and a 1.0 GHz frequency point with a documented headroom to 1.5 GHz on related MPC7448 parts. The 64-bit system bus and 36-bit physical addressing support up to 64 GB of attached memory.
Architecturally, the MPC7447A is a superscalar out-of-order PowerPC core with seven execution units, branch prediction with a 512-entry branch history table, and a dedicated L2 prefetch engine. The AltiVec unit adds a SIMD pipeline capable of 4-wide single-precision floating point or 16-wide integer ops per cycle, which is why the part was selected for embedded imaging, radar DSP, telecom baseband, and network processing cards rather than purely control-plane roles.
Typical applications include embedded single-board computers in industrial and aerospace, telecom line-card DSP, medical imaging accelerators, military signal processing (the part appears on DSCC Qualified Parts Lists per NXP), router/control-plane processors, and Apple Power Mac G4 (Late 2004 and earlier) logic board service replacement. Designed as a pin-compatible replacement for the older MPC7447 and MPC7445, it drops into existing socket designs.
When designing with this part, ensure a robust multi-rail DC-DC design for the 1.25-1.35 V core and 1.8/2.5 V I/O plus VTT termination for the 64-bit bus. Mind the BGA thermal envelope: thermal design power at 1 GHz is on the order of 15-21 W and demands a heatsink or cold-plate in production.
This page synthesizes verified distributor pricing, drop-in alternatives (MPC7447A family pin-compatible variants at 1.0-1.4 GHz), thermal and PCB design notes, and lifecycle guidance not found in the bare manufacturer datasheet - data current as of 2026-10-17.
Drop-in-Alternativen für MC7447AVU1000NB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC7447AVU1000NB (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Mounting Type, L2 Cache, Core Architecture, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC7447AHX1000LB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC7447AHX1333LB
✅ Drop-In✓ Auf Lager
$54 / Stück
Datenblatt ansehen →MC7447AHX1400LB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC7447AVU733NB
✅ Drop-In✓ Auf Lager
$72 / Stück
Datenblatt ansehen →KMC7447AVU1000NB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC7448VU1000LD
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$225.9 / Stück
Datenblatt ansehen →MC7447AVU1000NB Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC G4 (MPC7447A) |
| Instruction Set | 32-bit PowerPC RISC |
| Core Frequency | 1.0 GHz |
| Bus Width | 64-bit external bus |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | 512 KB on-chip |
| SIMD Engine | AltiVec (128-bit VMX) |
| Number of Cores | 1 |
| Core Supply Voltage (Vdd) | 1.25 V to 1.35 V |
| I/O Supply Voltage | 1.8 V / 2.5 V |
| Process Technology | Silicon-on-Insulator (SOI), 0.13 um |
| Betriebstemperatur | 0C to +105C (commercial) |
| Gehäuse | 360-FCCBGA (Flip-Chip Ceramic BGA), 25x25 mm |
| Montageart | Surface Mount (BGA socket or solder) |
| Multi-Core Support | Single core (no SMP fabric on-package) |
| Floating Point Unit | Double-precision FPU + AltiVec single-precision SIMD |
| Instruction Cache | 32 KB (Harvard) |
| Branch Target Buffer | 512-entry BHT |
MC7447AVU1000NB 360-fccbga (flip-chip ceramic bga), 25x25 mm Pinbelegungsleitfaden
Pinbelegung für MC7447AVU1000NB (360-fccbga (flip-chip ceramic bga), 25x25 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC7447AVU1000NB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC7447AVU1000NB ist geeignet für 6 Anwendungs: Apple Power Mac G4 Logic Board Service, Embedded Telecom Line-Card DSP, Aerospace/Military Embedded SBC, Industrial Machine Vision Accelerator, Medical Imaging Console Processor, Network Processing / Router Control Plane.
Apple Power Mac G4 Logic Board Service
The MC7447AVU1000NB was the 1.0 GHz PowerPC G4 CPU fitted in later Apple Power Mac G4 (Digital Audio/Mirrored Drive Doors/FW800) logic boards where the original 7447/7445 socketed CPU was a service-replaceable assembly. Apple designed the G4 with a removable CPU module on a microcarrier board, and the 1.0 GHz MC7447A provides a drop-in upgrade for failing daughter cards. The 512 KB on-chip L2 keeps the cost-per-repair low versus a full logic-board swap. Repair shops should treat every 1 GHz module as a BGA-rework part; thermal pads must be replaced and the heatsink cleaned during reinstallation to keep the junction inside Apple's 105 C spec.
Empfohlen
Embedded Telecom Line-Card DSP
Telecom line-card and media-gateway platforms used the MPC7447A's combination of AltiVec SIMD and 1.0 GHz single-thread performance to handle packet classification, IPSec transforms and voice-over-IP mixing in deterministic CPU cycles. The 64-bit external bus supports the wide DMA fetches that line-card ASICs need to push cell/packet payloads to the host CPU. The 360-FCCBGA's 25x25 mm footprint allows the part to fit alongside DSP ASICs and PHYs on ATCA-style line cards. Designers should budget for the documented 15-21 W core dissipation at 1 GHz and ensure forced-air cooling or cold-plate attachment, especially in sealed outdoor enclosures.
Empfohlen
Aerospace/Military Embedded SBC
NXP's PowerPC G4 line was historically qualified on DLA/QPL lists for military embedded single-board computers, and the MC7447AVU1000NB was used in avionics, radar pre-processor and naval signal-processing SBCs that require pin-compatible multi-source availability. The 360-FCCBGA's ceramic body supports MIL-STD-883 environmental stress screening more readily than plastic BGA variants from later MPC8641D parts, which is why legacy aerospace programs retain stock. Designs must isolate the 1.25-1.35 V core rail on a low-noise DC-DC point-of-load and bond the I/O rail to tolerant 1.8/2.5 V bridge devices to meet MIL-EMC margins.
Empfohlen
Industrial Machine Vision Accelerator
Industrial machine-vision controller boards deployed the MPC7447A's AltiVec unit for real-time image pre-processing: 8x8 pixel-block convolution, edge detection (Sobel/SUSAN) and noise filtering all map cleanly onto AltiVec's 16-wide integer SIMD. Hosting the MC7447AVU1000NB alongside a frame-grabber ASIC let factory-floor cameras do 30 fps inspection at 1.0 GHz without off-loading to a host PC. The 512 KB L2 captures working image-tile sets and reduces back-pressure on the 64-bit bus. Vision integrators should stage firmware updates through the JTAG port documented in the datasheet, watching that the industrial enclosure keeps ambient inside the part's 105 C case limit.
Empfohlen
Medical Imaging Console Processor
Medical imaging consoles (ultrasound front-end, endoscopy image-processing boards, CT pre-processor cards) have used the MPC7447A as the main CPU when paired with a dedicated FPGA that performs the high-bandwidth analog front-end acquisition. The MC7447AVU1000NB's deterministic single-thread latency suits real-time ultrasound beamforming controls where AltiVec handles the channel-data reductions. The FCCBGA ceramic package also eases the regulatory documentation trail because the medical device dossier simply references NXP's 360-BGA platform. Power-supply design must keep the 1.25 V core ripple below 30 mVpk-pk to meet IEEE/IEC medical EMC emissions margins.
Empfohlen
Network Processing / Router Control Plane
Carrier-grade routers and security appliances from the late 2000s deployed the MC7447AVU1000NB on the control-plane CPU board, where AltiVec accelerates the cipher (AES, SHA) primitives that route-processor lookups demand on every packet. The 64-bit external bus easily drives the classified-route-table memory and the JTAG-driven debug port simplifies firmware certification audits. Modern replacements often move to ARM SoCs, but the 1 GHz MPC7447A is still accepted where pin-compatible second-source legacy hardware must remain in service. Designers pairing an MPC7447A with a gigabit MAC ASIC should keep trace lengths matched to within 0.5 mm to honor the 64-bit bus timing window.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC7447AVU1000NB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC7447AHX1000LB | MC7447AHX1333LB | MC7447AVU733NB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.333 GHz | 733 MHz |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB |
| Core Voltage | 1.25 V to 1.35 V | 1.25 V to 1.35 V | 1.25 V to 1.35 V | 1.25 V to 1.35 V |
| External Bus Width | 64-bit | 64-bit | 64-bit | 64-bit |
| AltiVec SIMD Engine | Yes (128-bit VMX) | Yes (128-bit VMX) | Yes (128-bit VMX) | Yes (128-bit VMX) |
| Estimated TDP @ 1 GHz | 15-21 W (estimated) | Similar (~15-21 W) | Higher (~22-28 W) | Lower (~11-15 W) |
| Pin Compatibility with Original MPC7445 | Yes (drop-in 360-FCCBGA) | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- 1.0 GHz core frequency in a known pin-compatible 360-BGA package (vs. MC7447AVU733NB)
- Lower TDP at same frequency vs HX-stepping parts (vs. MC7447AHX1000LB)
- Pin-compatible with the entire MPC7445/MPC7447/MPC7447A socket family (vs. MC7448VU1000LD)
Designhinweise
The MC7447AVU1000NB requires two rails: Vdd_core at 1.25 V to 1.35 V (TBD up to ~12 A transient) and a separate I/O rail at 1.8 V or 2.5 V. Sequencing is required - the I/O rail must ramp before Vdd_core to prevent bus latch-up. VTT termination (via matched resistor net) must follow the 64-bit bus to prevent overshoot. Place decoupling MLCCs of 0.1 uF + 10 uF bulk immediately adjacent to each BGA power-ball cluster to control the high-current transients triggered by AltiVec unit activation. Estimated: peak core current at 1.0 GHz is in the 12-15 A range.
Estimated: the 1.0 GHz part dissipates 15-21 W, which on a 360-FCCBGA (typically theta_JA ~1-2 C/W with a heat-spreader) pushes a 1-2 C/W junction-rise per watt applied. Heatsink thermal design must hold the case below 105 C, leaving ~95 C ambient+rise budget for 15-21 W. A heat-spreader with thermal interface material (TIM) is essentially mandatory; passive cooling is only feasible if the host enclosure supplies forced-air at >2 m/s. Designers must revalidate thermal margin at 1.333 GHz or 1.4 GHz upgrades because TDP scales roughly linearly with frequency.
The 360-FCCBGA 25x25 mm footprint demands a 1.27 mm or 1.0 mm pitch BGA land pattern with micro-via-in-pad or dog-bone fan-out, with pairs of GND/Vdd-balls under the die stitched to internal power planes. The 64-bit bus must be length-matched to within 0.5 mm to honor the bus window; route on inner stripline layers referenced to continuous GND/Vdd planes. Place a 4- to 6-layer stack-up with two solid planes. JTAG (1149.1) signals should be routed to a 14-pin 0.1-inch header per datasheet JTAG pinout for board-level boundary-scan.
Do not power up Vdd_core before the I/O rail: this stresses the bus drivers and can latch up the I/O cells. Do not populate this part on a board laid out for the older MPC7450/MPC7455 - those are 484-BGA and not pin-compatible. Do not assume 1.333 GHz upgrades on the same socket will work thermally without revalidation - the 25-30% TDP increase can overheat the existing heatsink. Finally, the part is approaching last-time-buy; new code freeze should consider dual-sourcing against the MPC7448VU1000ND if availability becomes an issue.
Compliance-Informationen
PB-FREE marking per datasheet addendum suggests lead-free finish (consistent with RoHS-style), but no explicit RoHS/REACH/AEC-Q100 statement was present in the verified web data. AEC-Q100 not applicable for a high-performance embedded MPU; conflict-minerals declaration should be requested from NXP for compliance-critical builds.
