MC9RS08KB8CWJ574 vs MC9RS08KB4CWJ Vergleich

Detaillierter Direktvergleich von MC9RS08KB8CWJ574 von NXP Semiconductors und MC9RS08KB4CWJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9RS08KB8CWJ574 MC9RS08KB8CWJ574 - RS08 8-bit MCU, 8KB Flash, 20MHz | NXP

MC9RS08KB8CWJ574 - RS08 8-bit MCU, 8KB Flash, 20MHz | NXP

MC9RS08KB8CWJ574 Nrnd
NXP Semiconductors
MC9RS08KB4CWJ MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP

MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP

MC9RS08KB4CWJ ✗ Abgekündigt

Spezifikationsvergleich

Parameter MC9RS08KB8CWJ574 MC9RS08KB4CWJ
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,74 $1,49
Manufacturer NXP Semiconductors (formerly Freescale) —
Core RS08 (8-bit) —
Family RS08KB —
Program Memory Type Flash —
Program Memory Size 8 KB (8K x 8) 4 KB (4K x 8) Flash
CPU Speed (Max) 20 MHz —
Gehäuse / Bauform 20-SOIC (wide-body, 7.5 mm width) —
Montageart Surface Mount Surface Mount
Supply Voltage Range [DATA_NEEDED: VDD range] 2.5 V to 5.5 V
Betriebstemperaturbereich [DATA_NEEDED: temperature grade] —
RAM Size [DATA_NEEDED: SRAM size] 126 B
ADC [DATA_NEEDED: ADC channels and resolution] —
Number of I/O Pins [DATA_NEEDED: GPIO count] —
Timers [DATA_NEEDED: timer modules] —
Communication Interfaces [DATA_NEEDED: UART/SPI/I2C count] —
MSL-Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL moisture sensitivity level]
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Lead-Free [DATA_NEEDED: lead-free status] —
Country of Origin [DATA_NEEDED: COO] —
Core Processor — RS08
Core Size — 8-bit
CPU Speed — 20 MHz
EEPROM Size — None (Flash-based)
Number of I/O — 18
Connectivity — I2C, SPI
Peripherals — LVD, POR, PWM, WDT
Instruction Set — HC08 subset + BGND
Gehäuse — 20-pin SOIC (wide-body, tube)
Betriebstemperatur — -40C to +85C
Debug Interface — Background Debug Mode (BDM)
Datenbusbreite — 8-bit

Datenblätter & Ressourcen

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