MC9RS08KB8CWJ574 vs MC9RS08KB4CWJ Comparação
Comparação detalhada lado a lado de MC9RS08KB8CWJ574 por NXP Semiconductors e MC9RS08KB4CWJ por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP
MC9RS08KB4CWJ ✗ Fim de vidaComparação de especificações
| Parâmetro | MC9RS08KB8CWJ574 | MC9RS08KB4CWJ |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | Fim de vida |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,74 | $1,49 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Core | RS08 (8-bit) | — |
| Family | RS08KB | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 8 KB (8K x 8) | 4 KB (4K x 8) Flash |
| CPU Speed (Max) | 20 MHz | — |
| Encapsulamento / Caixa | 20-SOIC (wide-body, 7.5 mm width) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Supply Voltage Range | [DATA_NEEDED: VDD range] | 2.5 V to 5.5 V |
| Faixa de temperatura de operação | [DATA_NEEDED: temperature grade] | — |
| RAM Size | [DATA_NEEDED: SRAM size] | 126 B |
| ADC | [DATA_NEEDED: ADC channels and resolution] | — |
| Number of I/O Pins | [DATA_NEEDED: GPIO count] | — |
| Timers | [DATA_NEEDED: timer modules] | — |
| Communication Interfaces | [DATA_NEEDED: UART/SPI/I2C count] | — |
| Nível MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Country of Origin | [DATA_NEEDED: COO] | — |
| Core Processor | — | RS08 |
| Core Size | — | 8-bit |
| CPU Speed | — | 20 MHz |
| EEPROM Size | — | None (Flash-based) |
| Number of I/O | — | 18 |
| Connectivity | — | I2C, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Instruction Set | — | HC08 subset + BGND |
| Encapsulamento | — | 20-pin SOIC (wide-body, tube) |
| Temperatura de operação | — | -40C to +85C |
| Debug Interface | — | Background Debug Mode (BDM) |
| Largura do barramento de dados | — | 8-bit |