MC9S08AC128CFUE vs MC9S08AW60CFUE Vergleich
Detaillierter Direktvergleich von MC9S08AC128CFUE von NXP Semiconductors und MC9S08AW60CFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AC128CFUE | MC9S08AW60CFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7,41 | $8,10 |
| CPU Architecture | CISC S08 core | — |
| Architecture Family | MC9S08AC128 / Flexis AC family | — |
| Maximum CPU Frequency | 40 MHz | — |
| Datenbusbreite | 8 bit | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 128 KB | — |
| Internal RAM | 8 KB | — |
| ADC Resolution | 10 bit | — |
| ADC Channel Count | 16 channels | — |
| General-Purpose I/O | 54 pins | — |
| Typical Operating Supply Voltage | 3.3 V or 5 V | — |
| Operating Supply Range | 2.7 V to 5.5 V | — |
| Minimum Operating Temperature | -40 °C | — |
| Maximum Operating Temperature | 85 °C | — |
| Gehäuse | 64-QFP, 14 mm x 14 mm | 64-QFP, 14 x 14 mm |
| Montageart | Surface mount | — |
| Package Height | 2.4 mm maximum | 1 mm |
| Package Width | 14.1 mm maximum | — |
| Package Length | 14.1 mm maximum | — |
| RoHS-Status | EU RoHS compliant | — |
| Automotive Qualification | No | — |
| Product Type | — | 8-bit HCS08 microcontroller |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| RAM | — | 4 KB |
| Core | — | Enhanced HCS08 8-bit core |
| Versorgungsspannung | — | 2.7 V to 5.5 V |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Pitch | — | 0.50 mm |
| Montagestil | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Debug Interface | — | Single-wire background debug mode interface |
| Application Support | — | Industrial and automotive |
| Lebenszyklusstatus | — | NRND |
| Supplier Reference | — | NXP USA Inc. |