MC9S08AC128CFUE vs MC9S08AW60CFUE Comparación
Comparación detallada lado a lado de MC9S08AC128CFUE por NXP Semiconductors y MC9S08AW60CFUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AC128CFUE | MC9S08AW60CFUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7,41 | $8,10 |
| CPU Architecture | CISC S08 core | — |
| Architecture Family | MC9S08AC128 / Flexis AC family | — |
| Maximum CPU Frequency | 40 MHz | — |
| Ancho del bus de datos | 8 bit | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 128 KB | — |
| Internal RAM | 8 KB | — |
| ADC Resolution | 10 bit | — |
| ADC Channel Count | 16 channels | — |
| General-Purpose I/O | 54 pins | — |
| Typical Operating Supply Voltage | 3.3 V or 5 V | — |
| Operating Supply Range | 2.7 V to 5.5 V | — |
| Minimum Operating Temperature | -40 °C | — |
| Maximum Operating Temperature | 85 °C | — |
| Encapsulado | 64-QFP, 14 mm x 14 mm | 64-QFP, 14 x 14 mm |
| Tipo de montaje | Surface mount | — |
| Package Height | 2.4 mm maximum | 1 mm |
| Package Width | 14.1 mm maximum | — |
| Package Length | 14.1 mm maximum | — |
| Estado RoHS | EU RoHS compliant | — |
| Automotive Qualification | No | — |
| Product Type | — | 8-bit HCS08 microcontroller |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| RAM | — | 4 KB |
| Core | — | Enhanced HCS08 8-bit core |
| Tensión de alimentación | — | 2.7 V to 5.5 V |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Pitch | — | 0.50 mm |
| Estilo de montaje | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Debug Interface | — | Single-wire background debug mode interface |
| Application Support | — | Industrial and automotive |
| Estado del ciclo de vida | — | NRND |
| Supplier Reference | — | NXP USA Inc. |