MC9S08AC60CPUE vs MC9S08AW60CPUE Vergleich
Detaillierter Direktvergleich von MC9S08AC60CPUE von NXP Semiconductors und MC9S08AW60CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AC60CPUE | MC9S08AW60CPUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Product Type | 8-bit automotive microcontroller (MCU) | — |
| CPU Core | HCS08/S08 | — |
| Maximum Clock Speed | 40 MHz | — |
| Flash Memory | 60 KB | 60 KB (60K x 8) |
| Program Memory Organization | 60K × 8 bits | — |
| RAM | 2 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC Resolution | 10 bits | — |
| ADC Channel Count | Up to 16 channels | — |
| I/O Port Count | 38 | — |
| SCI Modules | 2 | — |
| Serial Protocol Support | LIN 2.0 and SAE J2602 | — |
| SPI Module | 1 | — |
| IIC Module | 1 | — |
| Gehäuse | 64-LQFP, 10 mm × 10 mm | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| Montageart | Surface mount | Surface Mount |
| RoHS-Status | RoHS compliant | — |
| Lebenszyklusstatus | NRND | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Speed (CPU Clock) | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| RAM Size | — | 4 KB |
| I/O Count | — | 38 |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| ADC | — | 10-bit |
| Instruction Set | — | HC08 (CISC) with added BGND instruction |
| Debug Interface | — | Single-wire background debug mode (BDM) |
| Betriebstemperatur | — | [DATA_NEEDED: Operating Temperature Range] |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |
| Family | — | HCS08 (S08AW) |