MC9S08AC60CPUE vs MC9S08AW60CPUE Comparação
Comparação detalhada lado a lado de MC9S08AC60CPUE por NXP Semiconductors e MC9S08AW60CPUE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08AC60CPUE | MC9S08AW60CPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $0,00 |
| Product Type | 8-bit automotive microcontroller (MCU) | — |
| CPU Core | HCS08/S08 | — |
| Maximum Clock Speed | 40 MHz | — |
| Flash Memory | 60 KB | 60 KB (60K x 8) |
| Program Memory Organization | 60K × 8 bits | — |
| RAM | 2 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC Resolution | 10 bits | — |
| ADC Channel Count | Up to 16 channels | — |
| I/O Port Count | 38 | — |
| SCI Modules | 2 | — |
| Serial Protocol Support | LIN 2.0 and SAE J2602 | — |
| SPI Module | 1 | — |
| IIC Module | 1 | — |
| Encapsulamento | 64-LQFP, 10 mm × 10 mm | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| Tipo de montagem | Surface mount | Surface Mount |
| Status RoHS | RoHS compliant | — |
| Status do ciclo de vida | NRND | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Speed (CPU Clock) | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| RAM Size | — | 4 KB |
| I/O Count | — | 38 |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| ADC | — | 10-bit |
| Instruction Set | — | HC08 (CISC) with added BGND instruction |
| Debug Interface | — | Single-wire background debug mode (BDM) |
| Temperatura de operação | — | [DATA_NEEDED: Operating Temperature Range] |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |
| Family | — | HCS08 (S08AW) |