MC9S08AW16CFGE vs MC9S08AW60CFGE Vergleich

Detaillierter Direktvergleich von MC9S08AW16CFGE von NXP Semiconductors und MC9S08AW60CFGE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08AW16CFGE MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP

MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP

MC9S08AW16CFGE Nrnd
NXP Semiconductors
MC9S08AW60CFGE MC9S08AW60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AW60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AW60CFGE Nrnd

Spezifikationsvergleich

Parameter MC9S08AW16CFGE MC9S08AW60CFGE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $0,00
Core Processor S08 (HCS08) S08 (HCS08) 8-bit CISC
Core Size 8-bit 8-Bit
CPU Speed 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Architecture CISC, HC08 instruction set with added BGND instruction —
Flash Memory 16KB (16K x 8) 60 KB (60K x 8)
RAM Size [DATA_NEEDED: RAM size] [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K)
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
I/O Ports 38 general-purpose I/O —
Debug Interface Single-wire background debug mode (BDM) Single-wire background debug mode (BDM)
Package Type 44-LQFP (10x10 mm) —
Package Outline QFNL, MO-220VKKD-2, 0.50 mm pitch, 1 mm height —
Montageart Surface Mount Surface Mount
Betriebstemperatur [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Family S08AW (AW60/AW48/AW32/AW16) MC9S08AW (S08AW series)
Target Industries Industrial and Automotive —
Lifecycle Status (NXP) NRND (Not Recommended for New Designs) —
RoHS-Status [DATA_NEEDED: RoHS status] —
Maximum CPU Frequency — 40 MHz
I/O Count — 38 general-purpose I/O
ADC Resolution — 10-bit, 8-channel
Instruction Set — HC08 instruction set with added BGND instruction
Gehäuse — 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2
Supply Voltage Nominal — 3.3 V / 5 V
Packaging — Tray
Lebenszyklusstatus — NRND (Not Recommended for New Designs) per NXP

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