MC9S08AW16CFGE vs MC9S08AW60CFGE Comparação
Comparação detalhada lado a lado de MC9S08AW16CFGE por NXP Semiconductors e MC9S08AW60CFGE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP
MC9S08AW16CFGE Nrnd
Comparação de especificações
| Parâmetro | MC9S08AW16CFGE | MC9S08AW60CFGE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $0,00 |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Architecture | CISC, HC08 instruction set with added BGND instruction | — |
| Flash Memory | 16KB (16K x 8) | 60 KB (60K x 8) |
| RAM Size | [DATA_NEEDED: RAM size] | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Ports | 38 general-purpose I/O | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Package Type | 44-LQFP (10x10 mm) | — |
| Package Outline | QFNL, MO-220VKKD-2, 0.50 mm pitch, 1 mm height | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Family | S08AW (AW60/AW48/AW32/AW16) | MC9S08AW (S08AW series) |
| Target Industries | Industrial and Automotive | — |
| Lifecycle Status (NXP) | NRND (Not Recommended for New Designs) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Maximum CPU Frequency | — | 40 MHz |
| I/O Count | — | 38 general-purpose I/O |
| ADC Resolution | — | 10-bit, 8-channel |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Encapsulamento | — | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |
| Supply Voltage Nominal | — | 3.3 V / 5 V |
| Packaging | — | Tray |
| Status do ciclo de vida | — | NRND (Not Recommended for New Designs) per NXP |