MC9S08DV60AMLF vs MC9S08DN32ACLC Vergleich
Detaillierter Direktvergleich von MC9S08DV60AMLF von NXP Semiconductors und MC9S08DN32ACLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32
MC9S08DN32ACLC ObsoleteSpezifikationsvergleich
| Parameter | MC9S08DV60AMLF | MC9S08DN32ACLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,60 | $4,35 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | S08DN |
| Core Processor | HCS08 (enhanced HC08 with BGND) | S08 (HCS08) |
| Core Size | 8-bit | 8-Bit |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | 32 KB (32K x 8) |
| RAM Size | 3 KB | 2 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 53 GPIO + 1 input-only | 25 |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | — |
| Timers | Multiple TPM (per datasheet family) | — |
| Gehäuse | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +125C | -40C to +85C |
| RoHS-Status | ROHS3 Compliant | — |
| Debug Interface | Single-wire BDM | — |
| CPU Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Type | — | FLASH |
| EEPROM Size | — | 1 KB (1K x 8) |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of Interrupt Sources | — | Up to 32 |
| Instruction Set | — | HC08 with added BGND |
| Versorgungsspannung | — | 2.7 V to 5.5 V |
| Part Status | — | Obsolete |