MC9S08DV60AMLF vs S9S08DV16F2MLC Vergleich
Detaillierter Direktvergleich von MC9S08DV60AMLF von NXP Semiconductors und S9S08DV16F2MLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DV60AMLF | S9S08DV16F2MLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,60 | $2,10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | S9S08DV16 |
| Core Processor | HCS08 (enhanced HC08 with BGND) | S08 (HCS08), 8-bit CISC |
| Core Size | 8-bit | 8-bit |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 3 KB | 2 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Number of I/O | 53 GPIO + 1 input-only | — |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | — |
| Timers | Multiple TPM (per datasheet family) | — |
| Gehäuse | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +125C | -40C to +125C |
| RoHS-Status | ROHS3 Compliant | [DATA_NEEDED: RoHS compliance status] |
| Debug Interface | Single-wire BDM | — |
| Maximale Taktfrequenz | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| ADC Resolution | — | 12-bit |
| Automotive Qualification | — | AEC-Q100 qualified |
| Connectivity | — | CAN, Serial (per family datasheet) |
| Data Programmers | — | On-chip emulation / background debug (BDM) |
| Packaging | — | Tray |
| EEPROM | — | Embedded EEPROM emulation supported (family feature) |