MC9S08DV60AMLF vs S9S08DV16F2MLC Comparação
Comparação detalhada lado a lado de MC9S08DV60AMLF por NXP Semiconductors e S9S08DV16F2MLC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08DV60AMLF | S9S08DV16F2MLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $4,60 | $2,10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | S9S08DV16 |
| Core Processor | HCS08 (enhanced HC08 with BGND) | S08 (HCS08), 8-bit CISC |
| Core Size | 8-bit | 8-bit |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 3 KB | 2 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Number of I/O | 53 GPIO + 1 input-only | — |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | — |
| Timers | Multiple TPM (per datasheet family) | — |
| Encapsulamento | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | -40C to +125C | -40C to +125C |
| Status RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS compliance status] |
| Debug Interface | Single-wire BDM | — |
| Frequência máxima de clock | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| ADC Resolution | — | 12-bit |
| Automotive Qualification | — | AEC-Q100 qualified |
| Connectivity | — | CAN, Serial (per family datasheet) |
| Data Programmers | — | On-chip emulation / background debug (BDM) |
| Packaging | — | Tray |
| EEPROM | — | Embedded EEPROM emulation supported (family feature) |