MC9S08DZ32AMLH vs MC9S08DN32CLC Vergleich
Detaillierter Direktvergleich von MC9S08DZ32AMLH von NXP Semiconductors und MC9S08DN32CLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DZ32AMLH | MC9S08DN32CLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $4,25 |
| Core Processor | HCS08 (S08 core) | S08 (HCS08) |
| Core Size | 8-Bit | 8-Bit |
| Instruction Set | HC08 with added BGND instruction (CISC) | — |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory Size | 32KB (32K x 8) FLASH | 32 KB (32K x 8) FLASH |
| Versorgungsspannung | 3.3V / 5V | — |
| ADC Resolution | 12 bit | — |
| ADC Channels | 24-channel | — |
| ADC Conversion Time | 2.5 us | — |
| CAN Module | Yes (embedded CAN, MSCAN) | — |
| EEPROM | Embedded EEPROM | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug Interface | On-chip emulation/debug (background debug, BGND) | — |
| Gehäuse | 64-LQFP (10x10 mm) | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Series | S08DZ (S08 Family, S08D Series) | — |
| Product Category | Microcontrollers (MCU) | — |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | — |
| CPU Speed | — | 40 MHz |
| RAM Size | — | 1 KB |
| EEPROM Size | — | 1 KB (1K x 8) |
| Number of I/O | — | 25 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 32 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | INDUSTRIAL |
| Part Status | — | Obsolete |