MC9S08DZ32AMLH vs MC9S08DN32CLC Comparação
Comparação detalhada lado a lado de MC9S08DZ32AMLH por NXP Semiconductors e MC9S08DN32CLC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08DZ32AMLH | MC9S08DN32CLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $4,25 |
| Core Processor | HCS08 (S08 core) | S08 (HCS08) |
| Core Size | 8-Bit | 8-Bit |
| Instruction Set | HC08 with added BGND instruction (CISC) | — |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory Size | 32KB (32K x 8) FLASH | 32 KB (32K x 8) FLASH |
| Tensão de alimentação | 3.3V / 5V | — |
| ADC Resolution | 12 bit | — |
| ADC Channels | 24-channel | — |
| ADC Conversion Time | 2.5 us | — |
| CAN Module | Yes (embedded CAN, MSCAN) | — |
| EEPROM | Embedded EEPROM | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug Interface | On-chip emulation/debug (background debug, BGND) | — |
| Encapsulamento | 64-LQFP (10x10 mm) | 32-LQFP (7x7 mm) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Series | S08DZ (S08 Family, S08D Series) | — |
| Product Category | Microcontrollers (MCU) | — |
| Status do ciclo de vida | NRND (Not Recommended for New Designs) | — |
| CPU Speed | — | 40 MHz |
| RAM Size | — | 1 KB |
| EEPROM Size | — | 1 KB (1K x 8) |
| Number of I/O | — | 25 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 32 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | INDUSTRIAL |
| Part Status | — | Obsolete |