MC9S08QD4MSC vs MC9S08QD4CSC Vergleich
Detaillierter Direktvergleich von MC9S08QD4MSC von NXP Semiconductors und MC9S08QD4CSC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08QD4MSC | MC9S08QD4CSC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,18 | $0,00 |
| Core | S08 (HCS08), 8-bit | — |
| Core Architecture | CISC, enhanced HCS08 | — |
| Maximum CPU Frequency | 16 MHz | — |
| Flash Memory | 4 KB (4K x 8) | 4 KB (4K x 8) |
| RAM | 256 B (0.256 KB) | 256 B |
| ADC | 4-channel, 10-bit | — |
| Number of I/Os | 6 | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | 3.3 V / 5 V |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 8-SOIC | 8-SOIC |
| Montageart | Surface Mount | Surface Mount |
| Series | S08QD (9S08QD4 series) | — |
| Debug Interface | Single-wire background debug (BDM active in STOP when ENBDM set) | Background debugging system (single-wire BDM) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Lebenszyklusstatus | End of Life (per NXP product page) | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maximale Taktfrequenz | — | 16 MHz |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |