MC9S08QD4MSC vs MC9S08QD4CSC Comparación
Comparación detallada lado a lado de MC9S08QD4MSC por NXP Semiconductors y MC9S08QD4CSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08QD4MSC | MC9S08QD4CSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,18 | $0,00 |
| Core | S08 (HCS08), 8-bit | — |
| Core Architecture | CISC, enhanced HCS08 | — |
| Maximum CPU Frequency | 16 MHz | — |
| Flash Memory | 4 KB (4K x 8) | 4 KB (4K x 8) |
| RAM | 256 B (0.256 KB) | 256 B |
| ADC | 4-channel, 10-bit | — |
| Number of I/Os | 6 | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | 3.3 V / 5 V |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 8-SOIC | 8-SOIC |
| Tipo de montaje | Surface Mount | Surface Mount |
| Series | S08QD (9S08QD4 series) | — |
| Debug Interface | Single-wire background debug (BDM active in STOP when ENBDM set) | Background debugging system (single-wire BDM) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Estado del ciclo de vida | End of Life (per NXP product page) | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frecuencia de reloj máxima | — | 16 MHz |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |