MC9S08QG4CFFE vs MC9S08QD4MSCR Vergleich
Detaillierter Direktvergleich von MC9S08QG4CFFE von NXP Semiconductors und MC9S08QD4MSCR von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08QG4CFFE | MC9S08QD4MSCR |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,10 | $3,15 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| Maximale Taktfrequenz | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | 4 KB (4K x 8) Flash |
| Versorgungsspannung | 2.5 V / 3.3 V | — |
| Gehäuse | 16-QFN-EP (5x5 mm), QFN EP | 8-SOIC (SO-8) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Lebenszyklusstatus | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Core | — | HCS08 (S08 core) |
| Datenbusbreite | — | 8 bit |
| Maximum CPU Frequency | — | 16 MHz |
| RAM Size | — | 256 B |
| Operating Voltage Range | — | 2.7 V to 5.5 V |
| ADC | — | 10-bit, 4 channels |
| Timers | — | Two 16-bit TPM |
| Communication Interface | — | SCI (UART) |
| Debug Interface | — | Background Debug Mode (BDM), single breakpoint |
| Instruction Set | — | HC08 with added BGND instruction |
| RoHS-Status | — | Compliant |
| MSL-Level | — | [DATA_NEEDED: MSL Level] |