MC9S08QG4CFFE vs MC9S08QD4MSCR 비교
다음의 상세 나란히 비교: MC9S08QG4CFFE 제조: NXP Semiconductors 및 MC9S08QD4MSCR 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MC9S08QG4CFFE | MC9S08QD4MSCR |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 수명 종료 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1.10 | $3.15 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| 최대 클록 주파수 | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | 4 KB (4K x 8) Flash |
| 공급 전압 | 2.5 V / 3.3 V | — |
| 패키지 | 16-QFN-EP (5x5 mm), QFN EP | 8-SOIC (SO-8) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| 수명 주기 상태 | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| 동작 온도 범위 | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Core | — | HCS08 (S08 core) |
| 데이터 버스 폭 | — | 8 bit |
| Maximum CPU Frequency | — | 16 MHz |
| RAM Size | — | 256 B |
| Operating Voltage Range | — | 2.7 V to 5.5 V |
| ADC | — | 10-bit, 4 channels |
| Timers | — | Two 16-bit TPM |
| Communication Interface | — | SCI (UART) |
| Debug Interface | — | Background Debug Mode (BDM), single breakpoint |
| Instruction Set | — | HC08 with added BGND instruction |
| RoHS 상태 | — | Compliant |
| MSL 레벨 | — | [DATA_NEEDED: MSL Level] |