MC9S08QG4CFFE vs MC9S08QG8CFQE Vergleich

Detaillierter Direktvergleich von MC9S08QG4CFFE von NXP Semiconductors und MC9S08QG8CFQE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ Abgekündigt
NXP Semiconductors
MC9S08QG8CFQE MC9S08QG8CFQE - 8-Bit HCS08 MCU 8KB Flash 20MHz | NXP

MC9S08QG8CFQE - 8-Bit HCS08 MCU 8KB Flash 20MHz | NXP

MC9S08QG8CFQE ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter MC9S08QG4CFFE MC9S08QG8CFQE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Ende des Lebenszyklus Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $1,10 $0,00
Core Processor S08 —
Core Size 8-Bit —
CPU Architecture HCS08 CISC, HC08 instruction set with added BGND instruction 8-bit CISC
Maximale Taktfrequenz 20 MHz —
Program Memory Size 4KB (4K x 8) FLASH —
Versorgungsspannung 2.5 V / 3.3 V —
Gehäuse 16-QFN-EP (5x5 mm), QFN EP 8-pin DFN-EP (4x4 mm)
Package Code HVQCCN —
Package Shape Square —
Number of Terminals 16 —
Terminal Form No Lead —
Temperature Grade Industrial —
Series S08QG (QG Series, S08 Family) —
Debug Features Background debugging system, single breakpoint in-circuit plus two more on-chip —
Montageart Surface Mount Surface Mount
Packaging Tray —
Lebenszyklusstatus End of Life (per NXP product page) End-of-Life / Last Time Buy (per NXP product page)
Program RAM Size [DATA_NEEDED: Program RAM size] —
ADC Resolution [DATA_NEEDED: ADC resolution and channels] —
Number of I/O [DATA_NEEDED: number of GPIO] —
Betriebstemperaturbereich [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Data Converters [DATA_NEEDED: on-chip data converter summary] —
Core — HCS08 (enhanced S08)
Maximum CPU Frequency — 20 MHz
Program Memory (Flash) — 8 KB (8K x 8)
RAM — [DATA_NEEDED: RAM size]
Supply Voltage (VDD) — 1.8 V to 3.6 V
I/O Pins — Up to 6
On-chip Debug — Background Debug Mode (BDCS), 1 + 2 breakpoints
Instruction Set — HC08 + BGND
ROM Type — Flash
RoHS-Status — ROHS compliant (per datasheet)

Datenblätter & Ressourcen

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