MC9S12A256BCPV vs MC9S12A256BCFU Vergleich

Detaillierter Direktvergleich von MC9S12A256BCPV von NXP Semiconductors und MC9S12A256BCFU von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12A256BCPV MC9S12A256BCPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12A256BCPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12A256BCPV Obsolete
NXP Semiconductors
MC9S12A256BCFU MC9S12A256BCFU - HCS12 16-Bit 25MHz 256KB Flash MCU | NXP

MC9S12A256BCFU - HCS12 16-Bit 25MHz 256KB Flash MCU | NXP

MC9S12A256BCFU ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12A256BCPV MC9S12A256BCFU
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $10,45 $18,20
Core Architecture HCS12 (16-bit CISC) —
Datenbusbreite 16-bit —
Maximale Taktfrequenz 25 MHz —
Program Memory Size 256 KB (256K x 8) Flash —
RAM Size 12 KB —
Supply Voltage - Operating 2.35 V to 5.25 V —
Operating Supply Voltage (Nominal) 2.5 V / 5 V —
Gehäuse / Bauform 112-LQFP (20x20 mm) —
Montageart Surface Mount Surface Mount
Betriebstemperaturbereich [DATA_NEEDED: operating temperature] —
Number of I/O Pins [DATA_NEEDED: number of I/O pins] —
ADC 8-channel 10-bit 10-bit, 8 channels
Connectivity CAN, SCI, SPI —
Peripherals PWM, Watchdog, BDM —
MSL-Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
RoHS-Status Compliant [DATA_NEEDED: RoHS status]
Halogenfrei Not Halogen Free (per cross-reference data) —
ECC EAR99 —
Country of Origin United States of America —
Introduction Date February 26, 2002 —
Manufacturer — NXP Semiconductors (formerly Freescale/Motorola)
Series — HCS12 / S12A
Core — HCS12 16-bit CISC
Program Memory — 256 KB Flash (256K x 8)
RAM — 12 KB
EEPROM — 4 KB
Maximum CPU Frequency — 25 MHz (bus clock via PLL)
Versorgungsspannung — 5 V single supply
Betriebstemperatur — -40 C to +85 C (industrial)
Gehäuse — 80-QFP (14 x 14 mm)
Communication — 2x SCI (UART), 2x SPI, 1x CAN 2.0 A/B, I2C
Timers / PWM — 8-channel 16-bit timer with PWM
GPIO — Up to 59 multiplexed I/O
Debug Interface — BDM (Background Debug Mode)

Datenblätter & Ressourcen

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