MC9S12A256BCFU - HCS12 16-Bit 25MHz 256KB Flash MCU | NXP
Teilenummer: MC9S12A256BCFU ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.8 | $258,00 |
| 100 | $22.95 | $2.295,00 |
| 500 | $20.4 | $10.200,00 |
| 1.000 | $18.2 | $18.200,00 |
MC9S12A256BCFU Übersicht
A microcontroller (MCU) is a self-contained processing system that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and peripheral interfaces on a single silicon die. The HCS12 architecture is a 16-bit CISC core from the Motorola/Freescale (now NXP) S12 family, designed for deterministic real-time control in automotive and industrial applications, and positioned hierarchically as: HCS12 -> 16-bit MCU -> microcontroller -> embedded processor -> semiconductor. The MC9S12A256BCFU is one of the highest-memory-density members of the original S12A sub-family.
Key features include 256KB on-chip Flash (in-application reprogrammable in 512-byte sectors), 4KB EEPROM for data storage, 12KB RAM, 8-channel 10-bit ADC, up to 25MHz bus clock via an on-chip PLL, two SCI, two SPI, an 8-channel 16-bit timer with PWM, and a CAN 2.0 A/B module. The part operates from a single 5V supply and supports an industrial -40C to +85C temperature range, making it suitable for under-hood and factory-floor environments.
Architecturally, the HCS12 core uses a 16-bit accumulator-based ALU with enhanced indexed addressing, background debug mode (BDM) for non-intrusive in-circuit development, and a memory management scheme supporting up to 1MB linear address space. The 80-QFP package exposes the full set of multiplexed GPIO, ADC inputs, and communication lines, enabling direct PCB integration of complex node functions without external glue logic.
Typical applications include automotive body controllers, instrument cluster electronics, industrial CAN nodes, sensor aggregation hubs, and ruggedized embedded control boards. The on-chip CAN 2.0 module is particularly valuable in distributed vehicle networks where deterministic multi-node communication is required. The wide operating temperature range and high-noise-immunity design also suit HVAC and motor control appliances.
When designing with this MCU, plan for a 5V analog supply and a 5V digital supply (which may be tied together with proper decoupling), plus a noise-isolated 2.5V AVDD for the ADC. Use the BDM interface for development and field firmware update via the in-application Flash programmer, and allocate adequate PCB ground area beneath the exposed die-pad to meet thermal and EMI requirements.
This page synthesizes distributor stock, same-package drop-in alternates, and practical design notes not found in any single distributor listing, giving engineers a single source to evaluate MC9S12A256BCFU for new designs, second-source qualification, or legacy board rework.
Drop-in-Alternativen für MC9S12A256BCFU – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12A256BCFU (gleiche Bauform und Footprint) – abweichend in ADC, Supply Voltage, Package, Core, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12A256CFUE
✅ Drop-In✓ Auf Lager
$47.08 / Stück
Datenblatt ansehen →MC9S12A256BCPV
✅ Drop-In✓ Auf Lager
$10.45 / Stück
Datenblatt ansehen →MC9S12A256CPVE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12A512CFUE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12A128BCFU
✅ Drop-In✓ Auf Lager
$18.2 / Stück
Datenblatt ansehen →MC9S12A256BCFU Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | HCS12 / S12A |
| Core | HCS12 16-bit CISC |
| Program Memory | 256 KB Flash (256K x 8) |
| RAM | 12 KB |
| EEPROM | 4 KB |
| Maximum CPU Frequency | 25 MHz (bus clock via PLL) |
| Versorgungsspannung | 5 V single supply |
| Betriebstemperatur | -40 C to +85 C (industrial) |
| ADC | 10-bit, 8 channels |
| Gehäuse | 80-QFP (14 x 14 mm) |
| Montageart | Surface Mount |
| Communication | 2x SCI (UART), 2x SPI, 1x CAN 2.0 A/B, I2C |
| Timers / PWM | 8-channel 16-bit timer with PWM |
| GPIO | Up to 59 multiplexed I/O |
| Debug Interface | BDM (Background Debug Mode) |
MC9S12A256BCFU Pin-Konfiguration
| Pin 1 | VRH — ADC high reference voltage |
| Pin 2 | VRL — ADC low reference voltage |
| Pin 3 | VDDA — Analog supply voltage |
| Pin 4 | VSSA — Analog ground |
| Pin 5 | PAD0/AN0 — Port AD bit 0 / ADC analog input 0 |
| Pin 6 | PAD1/AN1 — Port AD bit 1 / ADC analog input 1 |
| Pin 7 | PAD2/AN2 — Port AD bit 2 / ADC analog input 2 |
| Pin 8 | PAD3/AN3 — Port AD bit 3 / ADC analog input 3 |
| Pin 9 | PAD4/AN4 — Port AD bit 4 / ADC analog input 4 |
| Pin 10 | PAD5/AN5 — Port AD bit 5 / ADC analog input 5 |
| Pin 11 | PAD6/AN6 — Port AD bit 6 / ADC analog input 6 |
| Pin 12 | PAD7/AN7 — Port AD bit 7 / ADC analog input 7 |
| Pin 13 | VDDR — Regulator supply voltage |
| Pin 14 | VSSR — Regulator ground |
| Pin 15 | VDD1 — Internal logic supply 1 |
| Pin 16 | VDD2 — Internal logic supply 2 |
| Pin 17 | VSS1 — Internal logic ground 1 |
| Pin 18 | VSS2 — Internal logic ground 2 |
| Pin 19 | BKGD — Background Debug Mode pin |
| Pin 20 | RESET — External reset (active low) |
| Pin 21 | PE0/XIRQ — Port E bit 0 / external IRQ |
| Pin 22 | PE1/IRQ — Port E bit 1 / IRQ |
| Pin 23 | PE2 — Port E bit 2 |
| Pin 24 | PE3 — Port E bit 3 |
| Pin 25 | PE4/ECLK — Port E bit 4 / E-clock output |
| Pin 26 | PE5/MODA — Port E bit 5 / mode select A |
| Pin 27 | PE6/MODB — Port E bit 6 / mode select B |
| Pin 28 | PE7 — Port E bit 7 |
| Pin 29 | PA0 — Port A bit 0 |
| Pin 30 | PA1 — Port A bit 1 |
| Pin 31 | PA2 — Port A bit 2 |
| Pin 32 | PA3 — Port A bit 3 |
| Pin 33 | PA4 — Port A bit 4 |
| Pin 34 | PA5 — Port A bit 5 |
| Pin 35 | PA6 — Port A bit 6 |
| Pin 36 | PA7 — Port A bit 7 |
| Pin 37 | PB0 — Port B bit 0 |
| Pin 38 | PB1 — Port B bit 1 |
| Pin 39 | PB2 — Port B bit 2 |
| Pin 40 | PB3 — Port B bit 3 |
| Pin 41 | PB4 — Port B bit 4 |
| Pin 42 | PB5 — Port B bit 5 |
| Pin 43 | PB6 — Port B bit 6 |
| Pin 44 | PB7 — Port B bit 7 |
| Pin 45 | PC0 — Port C bit 0 |
| Pin 46 | PC1 — Port C bit 1 |
| Pin 47 | PC2 — Port C bit 2 |
| Pin 48 | PC3 — Port C bit 3 |
| Pin 49 | PC4 — Port C bit 4 |
| Pin 50 | PC5 — Port C bit 5 |
| Pin 51 | PC6 — Port C bit 6 |
| Pin 52 | PC7 — Port C bit 7 |
| Pin 53 | PP0/KWP0 — Port P bit 0 / PWM / KWP module |
| Pin 54 | PP1/KWP1 — Port P bit 1 / PWM / KWP module |
| Pin 55 | PP2/KWP2 — Port P bit 2 / PWM / KWP module |
| Pin 56 | PP3/KWP3 — Port P bit 3 / PWM / KWP module |
| Pin 57 | PP4/KWP4 — Port P bit 4 / PWM / KWP module |
| Pin 58 | PP5/KWP5 — Port P bit 5 / PWM / KWP module |
| Pin 59 | PP6/KWP6 — Port P bit 6 / PWM / KWP module |
| Pin 60 | PP7/KWP7 — Port P bit 7 / PWM / KWP module |
| Pin 61 | PS0/RxD0 — Port S bit 0 / SCI0 receive |
| Pin 62 | PS1/TxD0 — Port S bit 1 / SCI0 transmit |
| Pin 63 | PS2/RxD1 — Port S bit 2 / SCI1 receive |
| Pin 64 | PS3/TxD1 — Port S bit 3 / SCI1 transmit |
| Pin 65 | PS4/MISO0 — Port S bit 4 / SPI0 MISO |
| Pin 66 | PS5/MOSI0 — Port S bit 5 / SPI0 MOSI |
| Pin 67 | PS6/SCK0 — Port S bit 6 / SPI0 SCK |
| Pin 68 | PS7/SS0 — Port S bit 7 / SPI0 SS |
| Pin 69 | PT0/IOC0 — Port T bit 0 / timer channel |
| Pin 70 | PT1/IOC1 — Port T bit 1 / timer channel |
| Pin 71 | PT2/IOC2 — Port T bit 2 / timer channel |
| Pin 72 | PT3/IOC3 — Port T bit 3 / timer channel |
| Pin 73 | PT4/IOC4 — Port T bit 4 / timer channel |
| Pin 74 | PT5/IOC5 — Port T bit 5 / timer channel |
| Pin 75 | PT6/IOC6 — Port T bit 6 / timer channel |
| Pin 76 | PT7/IOC7 — Port T bit 7 / timer channel |
| Pin 77 | CAN_TX — CAN 2.0 transmit output |
| Pin 78 | CAN_RX — CAN 2.0 receive input |
| Pin 79 | XOUT — Crystal oscillator output |
| Pin 80 | XIN — Crystal oscillator input / EXTAL |
Typische Anwendungen
MC9S12A256BCFU ist geeignet für 6 Anwendungs: Automotive Body Control Module, Industrial CAN Node Controller, HVAC and Appliance Control Board, Instrument Cluster Driver, Sensor Aggregation Hub, Motor Control and PWM Drive Board.
Automotive Body Control Module
The MC9S12A256BCFU is well suited for central body controllers in mid-size vehicles because it integrates a CAN 2.0 A/B controller, two SCI/UART, two SPI, and an 8-channel 16-bit timer/PWM on a single 16-bit core running at 25MHz. With 256KB Flash it can host a full BCM firmware image plus bootloader, while 4KB EEPROM supports non-volatile configuration storage (trim, learned customer preferences, fault logs). The 5V single-supply operation and industrial temperature grade match under-dash automotive environments, and the 80-QFP package gives enough GPIO to drive lights, wipers, door locks, and switches directly.
Empfohlen
Industrial CAN Node Controller
The MC9S12A256BCFU's on-chip CAN 2.0 module plus 256KB Flash makes it an ideal distributed node controller in industrial CANopen and DeviceNet networks. The 25MHz HCS12 core executes deterministic control loops while the CAN peripheral handles message arbitration with hardware acceptance filtering. Its 8-channel 10-bit ADC reads analog sensors directly, the 16-bit timer provides PWM outputs for proportional valves or motor speed, and 12KB RAM supports protocol stacks and control buffers. Industrial temperature range (-40 to +85C) tolerates cabinet and machine-mount environments.
Empfohlen
HVAC and Appliance Control Board
The MC9S12A256BCFU fits HVAC and white-goods controllers that need a 5V single-supply MCU with multiple PWM channels, ADC inputs for temperature/pressure sensors, and enough Flash for control algorithms plus UI state machines. Its 256KB Flash hosts modulation firmware, lookup tables for compressor curves, and diagnostic routines. The 4KB EEPROM retains user settings through power cycles. The 8-channel 16-bit timer provides zero-crossing controlled TRIAC drive, while the HCS12 deterministic interrupt latency keeps line-frequency timing tight.
Empfohlen
Instrument Cluster Driver
For automotive instrument clusters, the MC9S12A256BCFU drives stepper gauge motors, multiplexed LCD/LED displays, and reads fuel/temperature sensors via its 10-bit ADC. The CAN 2.0 module receives vehicle data from the BCM or powertrain ECU, while the SCI/UART ports support diagnostic interfaces (K-line or LIN master) for service tooling. 256KB Flash stores gauge calibration tables and warning logic, 12KB RAM holds display buffer state, and the 80-QFP package fits behind the cluster bezel. Industrial temperature grade covers dashboard thermal stress.
Empfohlen
Sensor Aggregation Hub
The MC9S12A256BCFU serves as a sensor-aggregation hub that reads multiple analog/digital sensors and forwards processed data over CAN. Its 8-channel 10-bit ADC plus external interrupt-driven digital inputs can scan temperature, pressure, level, and position sensors, while the 256KB Flash holds sensor linearization tables and filtering code. The 12KB RAM supports circular buffers for multiple sensor streams, and the two SCI/SPI interfaces expose service and expansion ports. Deterministic HCS12 interrupt handling keeps scan loops time-aligned across the cluster.
Empfohlen
Motor Control and PWM Drive Board
The MC9S12A256BCFU's 8-channel 16-bit timer with PWM outputs directly drives brushless DC, stepper, or brushed DC motor stages. The HCS12 core runs field-oriented control or trapezoidal commutation routines with deterministic 25MHz timing, while 256KB Flash fits motor state-machine code plus tuning parameters. The on-chip CAN broadcasts motor telemetry back to the host controller. Industrial temperature and 5V supply suit factory-floor and 12V/24V vehicle motor subsystems. The 80-QFP footprint leaves room for current-sense amplifiers and gate drivers adjacent to the MCU.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12A256BCFU – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12A256CFUE | MC9S12A256BCPV | MC9S12A256CPVE | MC9S12A512CFUE | MC9S12A128BCFU |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP (14x14) | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same |
| Core | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit |
| Max CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB (+100%) | 128 KB (-50%) |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 14 KB | 12 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| CAN 2.0 Module | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Largest Flash density in S12A 80-QFP lineup (vs. MC9S12A128BCFU)
- Built-in CAN 2.0 controller for distributed networks (vs. MC9S12E64MFU)
- 256KB Flash vs S12E64MFU 64KB Flash (vs. MC9S12E64MFU)
- HCS12 deterministic CISC core vs S12XS XGATE coprocessor (vs. MC9S12XS128MAA)
Designhinweise
The MC9S12A256BCFU operates from a single 5V supply (VDDR/VDDx) but requires a separately filtered analog supply (VDDA) for the on-chip 10-bit ADC. Use a ferrite bead or pi-filter between VDDx and VDDA to keep digital switching noise out of ADC measurements, with 100nF and 10uF ceramic decoupling within 5mm of each supply pin. The on-chip voltage regulator generates 2.5V for internal logic; do not draw external load current from this rail.
A common mistake is leaving the BKGD (Background Debug Mode) pin floating during production. Tie BKGD to VDD through a 10k pull-up so the device enters normal operating mode instead of BDM debug mode on reset. Likewise, ensure the MODE signals (MODA/MODB) are tied to the correct logic levels at reset to select single-chip vs expanded bus mode for production parts.
When routing the CAN bus, place a TVS diode and common-mode choke close to the CANH/CANL pins to meet automotive transient immunity (ISO 7637). Keep the CAN bus differential traces matched in length (<5mm mismatch) and routed over a continuous ground plane. The on-chip CAN module tolerates only up to +-8kV ESD without external protection; for production ECUs, add a dedicated CAN bus protector such as NXP TJA1042 companion and bus ESD array.
Estimated: at 5V VCC, 25MHz CPU, all peripherals enabled, and ambient 25C, the MC9S12A256BCFU dissipates approximately 200-300mW worst case (per S12A datasheet IDD figures). The 80-QFP package provides adequate thermal relief for typical industrial environments, but in sealed enclosures above 70C ambient, derate the CPU clock to 20MHz or improve board airflow. Calculate junction temperature as TJ = TA + (PD x theta_JA), with theta_JA of the 80-QFP on 4-layer PCB around 50 C/W.
Route the EXTAL/XTAL traces symmetrically within 5mm of the part, surrounded by a ground guard ring on the same layer, and place the load capacitors within 2mm of the oscillator pins. Avoid routing high-frequency signals (CAN, SCI) parallel to the crystal traces; keep the SCI/CAN transceiver within 25mm of the MCU and place bulk decoupling where the transceiver power enters the PCB. Connect all VSS pins to a single uninterrupted ground pour under the package.
Compliance-Informationen
NXP S12A family is broadly AEC-Q100 qualified for automotive body applications per NXP product page. Lead-free reflow is supported. RoHS/REACH/halogen status: [DATA_NEEDED] - confirm on the latest NXP datasheet or material declaration.
