MC9S12DG256CCFU vs MC9S12DG256CCPV Vergleich
Detaillierter Direktvergleich von MC9S12DG256CCFU von NXP Semiconductors und MC9S12DG256CCPV von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndSpezifikationsvergleich
| Parameter | MC9S12DG256CCFU | MC9S12DG256CCPV |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,80 | $18,20 |
| Core Processor | HCS12 | — |
| Core Size | 16-bit | — |
| Architecture | CISC | — |
| Maximum Clock Speed | 25 MHz | — |
| Program Memory Size | 256KB (256K x 8) | — |
| Program Memory Type | FLASH | — |
| EEPROM Size | 4KB (4K x 8) | 4 KB |
| RAM Size | 12KB (12K x 8) | 12 KB |
| Versorgungsspannung | 2.5V / 5V | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | PWM, WDT, ECT timer | — |
| ADC Resolution | 10-bit, 2 x 8-channel | — |
| Number of I/O | 59 | — |
| Gehäuse | 80-QFP (14x14 mm), LQFP | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Part Status | Obsolete / NRND per manufacturer | — |
| Series | HCS12 / MC9S12DG256 (S12D family) | — |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Betriebstemperaturbereich | — | -40 °C to +85 °C (industrial) |
| Gehäuse / Bauform | — | 112-LQFP (20 x 20 mm) |
| ADC | — | 8-channel, 10-bit |
| PWM Channels | — | 8 channels |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| Timers | — | Enhanced Capture Timer (ECT) + watchdog |
| On-chip Debug | — | Background Debug Mode (BDM) |
| RoHS-Status | — | Compliant |
| MSL-Level | — | 3 (168 hours, JEDEC J-STD-020) |