MC9S12DG256CCPV vs MC9S12XDT256CPV Vergleich
Detaillierter Direktvergleich von MC9S12DG256CCPV von NXP Semiconductors und MC9S12XDT256CPV von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndNXP Semiconductors
MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
MC9S12XDT256CPV NrndSpezifikationsvergleich
| Parameter | MC9S12DG256CCPV | MC9S12XDT256CPV |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,20 | $12,25 |
| Core | HCS12 (16-bit CISC) | HCS12X (16-bit CISC with XGATE co-processor) |
| Maximum CPU/Bus Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM Size | 12 KB | — |
| EEPROM Size | 4 KB | — |
| Number of I/O Lines | 91 | — |
| Supply Voltage Range | 2.97 V to 5.5 V (single 5 V supply) | — |
| Betriebstemperaturbereich | -40 °C to +85 °C (industrial) | — |
| Gehäuse / Bauform | 112-LQFP (20 x 20 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| ADC | 8-channel, 10-bit | 8-channel, 10-bit ATD |
| PWM Channels | 8 channels | 4 x 8/16-bit PWM |
| Communication Interfaces | 2 x SCI, 2 x SPI, I2C, CAN 2.0 | — |
| Timers | Enhanced Capture Timer (ECT) + watchdog | ECT (Enhanced Capture Timer), PIT, RTI |
| On-chip Debug | Background Debug Mode (BDM) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| MSL-Level | 3 (168 hours, JEDEC J-STD-020) | — |
| Family | — | S12XD |
| Program Memory | — | 256 KB Flash |
| EEPROM | — | 4 KB |
| RAM | — | 12 KB |
| CPU Bus Frequency | — | 25 MHz / 40 MHz (max) |
| XGATE Co-processor | — | 80 MHz, RISC-style peripheral engine |
| Versorgungsspannung | — | 2.5 V / 5 V (dual-range) |
| Gehäuse | — | 112-LQFP (20 x 20 mm, 0.65 mm pitch) |
| Pin-Anzahl | — | 112 |
| Temperature Grade | — | Industrial (-40C to +85C) |
| CAN Modules | — | Up to 2 x CAN 2.0A/B (msCAN) |
| SCI / SPI / I2C | — | 2 x SCI, 2 x SPI, 1 x I2C |
| Debug Interface | — | BDM (Background Debug Mode) |