MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
Teilenummer: MC9S12XDT256CPV ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.75 | $18,75 |
| 10 | $17.1 | $171,00 |
| 100 | $15.4 | $1.540,00 |
| 500 | $13.85 | $6.925,00 |
| 1.000 | $12.25 | $12.250,00 |
MC9S12XDT256CPV Übersicht
An HCS12X microcontroller (MCU) is a 16-bit automotive-grade microcontroller that combines the legacy HCS12 instruction set with an XGATE peripheral co-processor to offload interrupt-driven tasks. It sits in the broader category: MCU -> 16-bit MCU -> HCS12X -> automotive MCU -> embedded processor -> semiconductor. The XGATE engine delivers up to 80 MIPS on peripheral events while the S12X CPU runs the application code, enabling deterministic real-time response in body, chassis, and gateway ECUs.
Key specifications include 256KB of program Flash with 4KB EEPROM and 12KB RAM, an 80 MHz XGATE peripheral co-processor, a 25/40 MHz CPU bus, an enhanced Capture Timer (ECT), four PWM channels with 8-bit or 16-bit resolution, up to two CAN 2.0A/B modules, two SCI, two SPI, an I2C bus, and an 8-channel 10-bit ATD (ADC). The 112-LQFP industrial temperature grade supports -40C to +85C, suiting under-the-hood and body-control modules.
Architecturally the device pairs the HCS12X CPU with the XGATE RISC co-processor, allowing peripheral DMA-style servicing. It supports background-debug mode (BDM), on-chip voltage regulator, and a periodic interrupt timer. The 112-LQFP package supports external address/data bus expansion, suitable for multi-drop automotive networks.
Typical applications include automotive body control, CAN/LIN gateway nodes, HVAC modules, instrument cluster MCUs, and industrial multiplexing controllers. The wide 2.5V/5V supply range simplifies integration into legacy 5V analog/mixed-signal automotive subsystems while preserving modern peripherals.
When designing with this part, ensure decoupling caps are placed close to VDD/VSS pairs and that unused pins are configured to a defined state in software to avoid shoot-through. The XGATE initialization must be performed before peripheral interrupts are enabled.
This page synthesizes distributor pricing, automotive-same-family drop-in alternatives, and practical firmware boot notes that complement the manufacturer datasheet reference manual.
Drop-in-Alternativen für MC9S12XDT256CPV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12XDT256CPV (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Processor, Supply Voltage, Timers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12XDT512MAA
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S12DT256CPVE
✅ Drop-In✓ Auf Lager
$20.85 / Stück
Datenblatt ansehen →MC9S12DG256CCPV
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$18.2 / Stück
Datenblatt ansehen →MC9S12A512CPVE
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$10.45 / Stück
Datenblatt ansehen →MC9S12XDT256CPV Grenzwerte & elektrische Eigenschaften
| Core | HCS12X (16-bit CISC with XGATE co-processor) |
| Family | S12XD |
| Program Memory | 256 KB Flash |
| EEPROM | 4 KB |
| RAM | 12 KB |
| CPU Bus Frequency | 25 MHz / 40 MHz (max) |
| XGATE Co-processor | 80 MHz, RISC-style peripheral engine |
| Versorgungsspannung | 2.5 V / 5 V (dual-range) |
| Gehäuse | 112-LQFP (20 x 20 mm, 0.65 mm pitch) |
| Pin-Anzahl | 112 |
| Temperature Grade | Industrial (-40C to +85C) |
| Montageart | Surface Mount |
| CAN Modules | Up to 2 x CAN 2.0A/B (msCAN) |
| SCI / SPI / I2C | 2 x SCI, 2 x SPI, 1 x I2C |
| ADC | 8-channel, 10-bit ATD |
| PWM Channels | 4 x 8/16-bit PWM |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI |
| Debug Interface | BDM (Background Debug Mode) |
MC9S12XDT256CPV 112-lqfp (20 x 20 mm, 0.65 mm pitch) Pinbelegungsleitfaden
Pinbelegung für MC9S12XDT256CPV (112-lqfp (20 x 20 mm, 0.65 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S12XDT256CPV.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S12XDT256CPV ist geeignet für 6 Anwendungs: Automotive Body Control Module, CAN/LIN Gateway ECU, HVAC Climate Control Module, Instrument Cluster Display Controller, Industrial Multiplexing Controller, Body Electronics Sensor Hub.
Automotive Body Control Module
The MC9S12XDT256CPV fits automotive BCM applications because it provides 256 KB Flash, 12 KB RAM, 4 KB EEPROM, and two CAN msCAN modules needed for body-network multiplexing. Its XGATE co-processor at 80 MHz offloads CAN message servicing and PWM updates, leaving the main HCS12X CPU free to run logical door/window/lighting state machines. Operating from a 5V regulated battery rail at industrial temperature (-40C to +85C), it survives underhood and behind-dash thermal conditions. Reference peripherals include ECT timer-driven window anti-pinch detection and the 10-bit ADC for switch-bouncing debounce of physical inputs.
Empfohlen
CAN/LIN Gateway ECU
The MC9S12XDT256CPV suits CAN/LIN gateway applications because dual msCAN channels and SCI/SPI peripherals allow bridges between in-vehicle networks. Placing a gateway ECU in chassis domains (drive, comfort, powertrain) benefits from the 80 MHz XGATE co-processor that handles high-throughput message routing without CPU throttling. The 256 KB Flash region stores routing tables and diagnostics firmware, while the 4 KB EEPROM preserves CAN IDs and feature flags across battery disconnect events. Industrial temperature grade and the wide 2.5V/5V supply range support integration with 5V analog sensor networks common in 2000s-era vehicle platforms.
Empfohlen
HVAC Climate Control Module
In HVAC control modules the MC9S12XDT256CPV supports dual-zone climate algorithms through the 8-channel 10-bit ATD for mixed-air temperature sensors, NTC monitoring, and stepper motor PWM outputs. The ECT and PWM channels operate blend and mode doors precisely using hardware timers, freeing the CPU from interrupt overhead. The 12 KB RAM holds closed-loop control loops and defrost schedules, while the 4 KB EEPROM non-volatilely stores user-set temperatures and driver preferences across battery disconnects. Industrial-grade -40C to +85C operation enables fast boot at sub-zero cabin temperatures.
Empfohlen
Instrument Cluster Display Controller
The MC9S12XDT256CPV drives analog/digital instrument clusters using the integrated SPI and PWM channels for dimming gauges and a stepper motor driver interface. The XGATE co-processor services SPI-driven display controllers and LIN/K-Line diagnostics in real time, while the HCS12X CPU runs state-based animations and warning logic. With 12 KB RAM the part buffers gauge sweeps and CAN-received vehicle speed signals; 4 KB EEPROM stores mileage and warning history. Industrial temperature grade and 5V tolerant pins simplify integration with legacy gauge-driver circuitry.
Empfohlen
Industrial Multiplexing Controller
Beyond automotive, the MC9S12XDT256CPV suits industrial RS-485 and CAN multiplexing controllers used in factory automation and process control. Dual CAN interfaces support DeviceNet and CANopen protocols, while the ECT timer provides hardware event capture for high-speed counters. Operating across 2.5V to 5V and industrial temperature, the part replaces legacy 8051 designs needing more deterministic interrupt response. The 4 KB EEPROM stores calibration constants and node IDs in non-volatile memory for field serviceability.
Empfohlen
Body Electronics Sensor Hub
The MC9S12XDT256CPV aggregates automotive sensors (parking aid, rain/light, occupancy, kicker) through the 8-channel 10-bit ADC and SPI/I2C peripherals. The XGATE co-processor services sensor I2C transactions at high rates without overloading the main CPU, allowing quick response to wake-up events. The 12 KB RAM buffers simultaneous multi-sensor samples; 256 KB Flash stores sensor calibration and runtime diagnostics. Industrial temperature grade enables reliable operation across extreme cabin and chassis conditions, and 5V-tolerant pins interface with legacy 5V sensors.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12XDT256CPV – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12XDT512MAA | MC9S12DT256CPVE | MC9S12DG256CCPV | MC9S12A512CPVE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same |
| Core | HCS12X + XGATE | HCS12X + XGATE | HCS12 (no XGATE) | HCS12 (no XGATE) | HCS12 (no XGATE) |
| Program Flash | 256 KB | 512 KB | 256 KB | 256 KB | 512 KB |
| RAM | 12 KB | 32 KB | 12 KB | 12 KB | 14 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| CPU Bus Frequency | 40 MHz | 40 MHz | 25 MHz | 25 MHz | 25 MHz |
| XGATE Co-processor | 80 MHz | 80 MHz | Not available | Not available | Not available |
| CAN Modules | 2 x msCAN | 2 x msCAN | 2 x msCAN | 2 x msCAN | 2 x msCAN |
| Lifecycle | NRND | Active | Active (legacy S12D) | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Integrated 80 MHz XGATE co-processor for peripheral offload (vs. MC9S12DT256CPVE (legacy S12D, no XGATE))
- Higher CPU bus speed (40 MHz) than legacy MC9S12DT256 (vs. MC9S12DT256CPVE (25 MHz CPU bus))
- Same S12XD pin-compatible migration path to 512 KB Flash (vs. MC9S12XDT512MAA (active, 512 KB Flash))
Designhinweise
Estimated: At a 5V VDD supplying 60 mA active and 50 uA Stop-mode current, design a decoupling network with 1x 4.7 uF + 2x 100 nF ceramic caps placed within 5 mm of each VDD/VSSX pair. The on-chip voltage regulator generates 2.5 V for the core; ensure VDDR (regulator ballast) has a 4.7 uF / low-ESR cap to GND. For Stop-mode designs, verify the RTI wake source is enabled in the MSCAN interrupt mask and that the BDM pin is left high-Z to avoid leakage.
For the 112-LQFP (0.65 mm pitch), use a 4-layer PCB with continuous VDD and GND planes under the MCU. Estimated: keep via stitching pitch below 3 mm around the perimeter to provide a low-impedance return for ADC inputs and ECT signals. Place external crystal traces within 5 mm of EXTAL/XTAL with short, guarded routing to avoid EMI coupling into the bus clock. Leave the no-connect pin footprint intact for test pads.
Beware three common pitfalls: (1) XGATE initialization order - the XGATE cannot run before PLL lock is acquired; gate interrupt sources with a software barrier. (2) EEPROM timing - wait for ECNFG CCIE before issuing EEPROM commands, or risk lost write cycles. (3) Background Debug Mode (BKGD) - leaving BKGD floating can cause spurious reset entries; tie to VDD via 10 kOhm pull-up. These three pitfalls match the most common S12XD field returns.
Estimated: MSCAN bus signals require termination only at the cable ends (120 ohm); do not intermediate-terminate on the MCU board. Use a 6.8 nF to 10 nF series cap on each CAN_H/CAN_L pin to the transceiver for EMI suppression. ECT capture pins are sensitive to noise - guard with a 33 ohm series resistor if routed near switching nodes. Keep ATD analog traces short and routed over a single unbroken ground plane.
Compliance-Informationen
Compliance certifications were not included in the verified web data; consult NXP product compliance documentation directly (npx.com part MC9S12XDT256CPV) for authoritative RoHS, REACH, and AEC-Q100 status. NRND lifecycle status noted.
