MC9S12DP512CPV vs MC9S12DP512MPVE Vergleich

Detaillierter Direktvergleich von MC9S12DP512CPV von NXP Semiconductors und MC9S12DP512MPVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12DP512CPV MC9S12DP512CPV - 16-Bit HCS12 MCU, 512KB Flash, 112-LQFP | NXP

MC9S12DP512CPV - 16-Bit HCS12 MCU, 512KB Flash, 112-LQFP | NXP

MC9S12DP512CPV ✓ Aktiv
NXP Semiconductors
MC9S12DP512MPVE MC9S12DP512MPVE - 16-bit 25MHz 512KB Flash MCU | NXP

MC9S12DP512MPVE - 16-bit 25MHz 512KB Flash MCU | NXP

MC9S12DP512MPVE ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12DP512CPV MC9S12DP512MPVE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $16,75 $9,45
Core HCS12 (16-bit) —
Bus Frequency 25 MHz —
Program Memory (Flash) 512 KB (512K x 8) —
RAM Size 12 KB (12K x 8) 12 KB
EEPROM 4 KB —
Number of I/O Lines 91 —
Gehäuse / Bauform 112-LQFP (20 x 20 mm) —
Montageart Surface Mount Surface Mount
Versorgungsspannung 5.0 V (4.5 V to 5.5 V) [DATA_NEEDED: supply voltage range]
Betriebstemperatur -40 C to +85 C (industrial) [DATA_NEEDED: operating temperature range]
ADC 2 x 8-channel, 10-bit —
PWM Channels 8 8-channel pulse-width modulator
Enhanced Capture Timer 8-channel 16-bit ECT —
SCI (UART) 2 —
SPI 1 —
I2C 1 —
CAN 1 x CAN 2.0 —
Oscillator Internal PLL with external crystal —
Debug Interface BDM (Background Debug Mode) —
Process Technology 0.25 um Flash —
RoHS-Status Compliant (lead-free) —
Core Processor — HCS12 (CPU12), 16-bit CISC
Core Size — 16-bit
Maximale Taktfrequenz — 25 MHz
Program Memory Size — 512 KB (512K x 8) Flash
EEPROM Size — 4 KB
Number of I/O — 91 general-purpose I/O
ADC Resolution — 10-bit
Number of ADC Channels — 16 (two 8-channel 10-bit ADCs)
Serial Interfaces — 2x SCI (asynchronous serial), IIC, SPI
Timers — 8-channel enhanced capture timer (IC/OC)
Gehäuse — 112-LQFP (20x20 mm)
Program Memory Type — FLASH (0.25 um)
Lebenszyklusstatus — Active

Datenblätter & Ressourcen

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