NXP Semiconductors

MC9S12DP512CPV - 16-Bit HCS12 MCU, 512KB Flash, 112-LQFP | NXP

Teilenummer: MC9S12DP512CPV ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
5.0 V (4.5 V to 5.5 V) Vdss 112-LQFP (20 x 20 mm) Package 25 MHz Speed 512 KB (512K x 8) Memory
Ab $16.75 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-08
Mengenpreise
Menge Stückpreis Gesamt
1 $28.5 $28,50
10 $25.8 $258,00
100 $22.4 $2.240,00
500 $19.1 $9.550,00
1.000 $16.75 $16.750,00
ℹ️ Alle Preise sind in USD

MC9S12DP512CPV Übersicht

The NXP (formerly Freescale/Motorola) MC9S12DP512CPV is a 16-bit HCS12 microcontroller featuring 512 KB of on-chip Flash, 12 KB of RAM, and 91 general-purpose I/O lines in a 112-pin LQFP package running at 25 MHz bus frequency. It is the top-of-memory variant of the pin-compatible S12D-Family that scales from 32 KB to 512 KB of Flash, providing an upward migration path from Freescale's legacy 68HC08, 68HC11, and 68HC12 architectures.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of on-chip peripherals. Within the broader taxonomy, the MC9S12DP512CPV sits in the HCS12 family of automotive-grade 16-bit microcontrollers, descending from the original Motorola 68HC12 architecture. It is commonly classified as an automotive MCU / embedded processor, with applications spanning body electronics, industrial control, and CAN-node subsystems.

Key features include two asynchronous Serial Communications Interfaces (SCI), one Serial Peripheral Interface (SPI), one Inter-IC (I2C) bus, an 8-channel 16-bit Enhanced Capture Timer (ECT), two 8-channel 10-bit Analog-to-Digital Converters (ADC), an 8-channel Pulse-Width Modulator (PWM), 20 discrete digital I/O lines with wake-up capability, and a Controller Area Network 2.0 (CAN 2.0) module. The S12 CPU core provides 16-bit native data paths with a 25 MHz bus for predictable real-time control performance.

The device is fabricated on Freescale's industry-leading 0.25 micrometer Flash process, providing reliable embedded non-volatile storage and a robust instruction set optimized for C-language embedded development. Multiple on-chip peripherals share a sophisticated interrupt and bus-arbitration scheme via the System Resource Mapping block, allowing deterministic latency for time-critical tasks such as PWM generation, ADC sampling, and CAN message handling.

Typical applications include automotive body controllers, HVAC control modules, instrument clusters, CAN-based sensor nodes, industrial automation PLCs, and any legacy 68HC12 system that requires a transparent upward memory migration. The wide operating voltage range and automotive-grade temperature support make it a workhorse for chassis and body-electronics ECUs.

When designing with this MCU, ensure your linker script accounts for the 512 KB Flash bank layout (sector erase = 1024 bytes, row = 64 words) and use the BDM (Background Debug Mode) interface for in-circuit programming and debug. For new platforms, prefer the pin-compatible MC9S12XDP512 (X-gate coprocessor, 2-5x performance) or the newer S12G family.

This page synthesizes distributor pricing for the MC9S12DP512CPV, drop-in same-package alternatives across the HCS12 family, and practical design notes not collated in the manufacturer datasheet.

Drop-in-Alternativen für MC9S12DP512CPV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12DP512CPV (gleiche Bauform und Footprint) – abweichend in Core Architecture, Operating Temperature, RAM Size, Program Memory Size, Serial Interfaces.

NXP Semiconductors
Core Architecture: HCS12 (16-bit CISC)
Operating Temperature: -40 C to +125 C (automotive)
Serial Interfaces: 2 x SCI (UART), 1 x SPI, 1 x I2C
Vergleichen mit MC9S12DP512CPV →
NXP Semiconductors
Core Architecture: HCS12, CISC
Vergleichen mit MC9S12DP512CPV →
NXP Semiconductors
Core Architecture: HCS12, CISC
Vergleichen mit MC9S12DP512CPV →
NXP Semiconductors
RAM Size: 12 KB
Program Memory Size: 512 KB (512K x 8) Flash
Serial Interfaces: 2x SCI (asynchronous serial), IIC, SPI
Vergleichen mit MC9S12DP512CPV →
NXP Semiconductors
RAM Size: 8 KB (8K x 8)
Vergleichen mit MC9S12DP512CPV →
NXP Semiconductors
Core Architecture: CISC
Operating Temperature: -40C to +85C (industrial)
RAM Size: 8 KB
Vergleichen mit MC9S12DP512CPV →
NXP Semiconductors
Core Architecture: 16-bit
Operating Temperature: -40C to +125C
Serial Interfaces: 2x SCI, IIC
Vergleichen mit MC9S12DP512CPV →
NXP Semiconductors
Operating Temperature: -40C to +125C (junction)
RAM Size: 12 KB
Program Memory Size: 128 KB (128K x 8) FLASH
Vergleichen mit MC9S12DP512CPV →
NXP Semiconductors
Core Architecture: HCS12X with XGATE co-processor
RAM Size: 32 KB (12 KB standard, derivative-dependent)
Program Memory Size: 512 KB Flash
Vergleichen mit MC9S12DP512CPV →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12DP512MPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (CPU12), 16-bit CISC · 16-bit · 25 MHz · 512 KB (512K x 8) Flash · 12 KB · 4 KB · 91 general-purpose I/O · 10-bit

✓ Auf Lager

$9.45 / Stück

Datenblatt ansehen →

MC9S12DP512CPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 CISC microcontroller · 25 MHz · 512 KB · 12 KB · 4 KB · Two 8-channel, 10-bit ADCs · 2 asynchronous serial communication interfaces · 8-channel IC/OC enhanced capture timer

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S12XDP512CPV

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X with XGATE co-processor · 16-bit · 512 KB Flash · 32 KB (12 KB standard, derivative-dependent) · 4 KB · 50 MHz bus (80 MHz on S12XD family) · 91 · 112-LQFP

✓ Auf Lager

$14.5 / Stück

Datenblatt ansehen →

MC9S12DP256CPV

✅ Drop-In
📦 112-LQFP (20x20)
Flash halved to 256 KB (-50%), same RAM, peripherals, and LQFP-112 footprint - suitable for smaller firmware

📋 Referenzalternative (nicht im Katalog)

MC9S12DG128CPV

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 25 MHz · 128 KB (128K x 8) · 8 KB · 2 KB · 91 · 112-LQFP (20 x 20 mm) · 8-channel, 10-bit ATD

✓ Auf Lager

$17.85 / Stück

Datenblatt ansehen →

MC9S12DT128MPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ Auf Lager

$36.5 / Stück

Datenblatt ansehen →

MC9S12DP512CPV Grenzwerte & elektrische Eigenschaften

Core HCS12 (16-bit)
Bus Frequency 25 MHz
Program Memory (Flash) 512 KB (512K x 8)
RAM Size 12 KB (12K x 8)
EEPROM 4 KB
Number of I/O Lines 91
Gehäuse / Bauform 112-LQFP (20 x 20 mm)
Montageart Surface Mount
Versorgungsspannung 5.0 V (4.5 V to 5.5 V)
Betriebstemperatur -40 C to +85 C (industrial)
ADC 2 x 8-channel, 10-bit
PWM Channels 8
Enhanced Capture Timer 8-channel 16-bit ECT
SCI (UART) 2
SPI 1
I2C 1
CAN 1 x CAN 2.0
Oscillator Internal PLL with external crystal
Debug Interface BDM (Background Debug Mode)
Process Technology 0.25 um Flash
RoHS-Status Compliant (lead-free)

MC9S12DP512CPV 112-lqfp (20 x 20 mm) Pinbelegungsleitfaden

Pinbelegung für MC9S12DP512CPV (112-lqfp (20 x 20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MC9S12DP512CPV im 112-lqfp (20 x 20 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MC9S12DP512CPV.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MC9S12DP512CPV ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), HVAC Control Module, Instrument Cluster Driver, CAN-Based Industrial Sensor Node, Legacy 68HC12 Migration Platform, Industrial Automation PLC.

🚗

Automotive Body Control Module (BCM)

The MC9S12DP512CPV is a strong fit for automotive BCM applications because of its 91 GPIO, dual SCI/UART channels for LIN/CAN gateway use, on-chip CAN 2.0 controller, and 8-channel PWM for driving lamps and motors. The 512 KB Flash accommodates the full BCM feature set including lighting control, central locking, wiper control, and diagnostic services without external memory expansion. HCS12's deterministic interrupt latency (down to ~80 ns at 25 MHz) ensures reliable real-time response for body-network message handling, while the industrial -40/+85 C grade on the CPV variant covers cabin-mounted ECUs.

🏭

HVAC Control Module

In HVAC control modules the MC9S12DP512CPV's two 8-channel 10-bit ADCs simultaneously sample cabin temperature, duct temperatures, and blend-door position sensors, while the 8-channel PWM drives blower-speed FETs and mode-door actuators without external PWM controllers. The 12 KB RAM is sufficient for PID control loops and lookup-table-based airflow calibration. Freescale's 0.25 um Flash process provides reliable in-field firmware updates via the BDM interface, and the pin-compatible S12D family allows OEMs to scale memory density (DP128, DP256) without re-spinning the PCB.

📺

Instrument Cluster Driver

Driving a stepper-motor or LCD instrument cluster, the MC9S12DP512CPV's Enhanced Capture Timer (ECT) and 8-channel PWM module generate precise analog-gauge drive waveforms and stepper pulse trains. The dual SCI channels support UART-based cluster diagnostics, while the SPI port interfaces to external LED-driver or graphics-controller companion ICs. With 512 KB of Flash the part stores full gauge calibration tables, odometer data in the 4 KB byte-erasable EEPROM, and bootloader code for end-of-line firmware programming.

🌐

CAN-Based Industrial Sensor Node

As an industrial CANopen or DeviceNet slave node, the MC9S12DP512CPV provides an integrated CAN 2.0 controller with 91 GPIO for sensor aggregation and digital outputs. The 25 MHz HCS12 core and dual SCI channels handle protocol stacks (CANopen / DeviceNet / custom) alongside sensor-sampling tasks. The 112-LQFP package exposes ample I/O for parallel sensor buses, and the same S12D PCB layout can be reused across node variants with different memory densities (DG128, DP256, DP512) to manage BOM cost.

🔧

Legacy 68HC12 Migration Platform

The MC9S12DP512CPV is the natural upward migration target for systems originally designed around the 68HC08, 68HC11, or 68HC12 with memory-pressure constraints. Freescale explicitly designed the S12D-Family as a pin-compatible superset that scales from 32 KB to 512 KB Flash while preserving peripheral register layouts, instruction set, and development tools. Existing 68HC12 firmware typically compiles and runs unchanged on the DP512 after minor linker-script adjustments to map the larger Flash bank, dramatically accelerating obsolescence-driven redesigns.

🏭

Industrial Automation PLC

For compact industrial PLCs and remote I/O modules, the MC9S12DP512CPV provides deterministic 16-bit performance at 25 MHz with 91 GPIO sufficient for 32 to 48 isolated digital inputs/outputs via external shift registers. The two SCI channels support RS-232/RS-485 master-slave communications, and the CAN 2.0 controller connects to industrial fieldbuses. Freescale's mature CodeWarrior and Cosmic toolchains, combined with the BDM debug port, allow rapid development and in-circuit firmware updates on factory-floor PLCs.

What is the program memory size of the MC9S12DP512CPV?
The MC9S12DP512CPV integrates 512 KB (512K x 8) of on-chip Flash program memory fabricated on Freescale's 0.25 um Flash technology. According to the NXP MC9S12DP512 device guide, the Flash is organized with 64-word rows and 1024-byte sector erase blocks, providing an upward migration target from the smaller 68HC12 and 68HC08 derivatives while preserving peripheral and pin compatibility across the S12D-Family.
How much RAM and EEPROM does the MC9S12DP512CPV have?
The MC9S12DP512CPV includes 12 KB (12K x 8) of static RAM and 4 KB of byte-erasable EEPROM for non-volatile data storage. The EEPROM supports byte, word, and bulk erase modes and is rated for typical automotive endurance, making it suitable for storing calibration constants, fault logs, and user-configurable parameters without external NVM.
What package does the MC9S12DP512CPV use?
The MC9S12DP512CPV ships in a 112-pin Low-profile Quad Flat Pack (112-LQFP) measuring 20 x 20 mm with 0.65 mm lead pitch and gull-wing terminations. The same LQFP-112 footprint is shared across the pin-compatible HCS12D-Family (DP256, DP128, DG128), enabling a single PCB layout to accept multiple memory-density variants without rework.
What is the operating voltage of the MC9S12DP512CPV?
The MC9S12DP512CPV operates from a single 5.0 V supply within the 4.5 V to 5.5 V range as specified in the manufacturer datasheet. An internal voltage regulator generates the core logic supply, and the device supports the full -40 C to +85 C industrial temperature window for body-electronics and under-hood automotive subsystems.
How many I/O pins does the MC9S12DP512CPV provide?
The MC9S12DP512CPV exposes 91 general-purpose digital I/O lines plus 20 discrete wake-up-capable I/O lines routed through the System Resource Mapping block. This large I/O count, along with multiplexed peripheral functions, allows the MCU to drive body controllers and instrument clusters without external I/O expanders.
Which on-chip peripherals does the MC9S12DP512CPV include?
The MC9S12DP512CPV integrates two asynchronous SCI (UART) channels, one SPI, one I2C, one CAN 2.0 controller, an 8-channel 16-bit Enhanced Capture Timer, two 8-channel 10-bit ADCs, an 8-channel PWM, and the standard S12 system-resource mapping for interrupts and clock generation. This peripheral set is sufficient for full automotive body-controller and CAN-node designs without external companion ICs.
What is the difference between the MC9S12DP512CPV and the MC9S12DP512MPVE?
The MC9S12DP512CPV is the industrial-temperature-grade (-40 C to +85 C) version in 112-LQFP, while the MC9S12DP512MPVE extends the operating range to -40 C to +105 C for under-hood automotive modules. Both share the identical HCS12 core, same 512 KB Flash, 12 KB RAM, and same LQFP-112 footprint, so they are drop-in compatible at the PCB level with only the temperature window differing.
Is the MC9S12DP512CPV still in production?
As of 2026-10-09, the MC9S12DP512CPV is still listed as Active by NXP Semiconductors with ongoing production for legacy automotive and industrial customers. For new designs, NXP recommends the pin-compatible S12X (MC9S12XDP512) or S12G families; however, the original S12D continues to ship for established platforms and long-life-cycle automotive programs.
Where can I buy the MC9S12DP512CPV online?
Authorized distributors such as DigiKey, Mouser, Arrow, and Avnet list the MC9S12DP512CPV with stock checks and immediate-ship options for prototype quantities. As of 2026-10-09, distributor listings on Octopart aggregate eight global sources; lead time for production quantities is typically 6 to 12 weeks. Independent distributors also list the part but require anti-counterfeit verification.
What is the price of the MC9S12DP512CPV?
Pricing for the MC9S12DP512CPV as of 2026-10-09 starts around USD 28.50 at qty-1, scaling to approximately USD 16.75 per unit at qty-1000 from authorized distributors. Pricing fluctuates with allocation cycles for legacy Flash microcontrollers; volume contracts negotiated directly with NXP typically yield additional 10-20% savings at annual commit levels.
Is the MC9S12DP512CPV in stock at major distributors?
Stock for the MC9S12DP512CPV varies by distributor as of 2026-10-09; Octopart aggregates live inventory across DigiKey, Mouser, Avnet, Arrow, and several independent distributors. Lead time for direct-from-NXP orders is typically 8 to 16 weeks depending on wafer allocation; we recommend confirming real-time stock at the point of order due to ongoing legacy-MCU demand.
MC9S12DP512CPV vs MC9S12XDP512 - which is better for new automotive designs?
The MC9S12XDP512 is the better choice for new automotive designs because it adds the XGATE co-processor delivering 2-5x the interrupt and peripheral throughput of the standard S12 core at 25 MHz, while keeping the same LQFP-112 footprint and peripheral register set. Choose the original MC9S12DP512CPV only when migrating legacy 68HC12 firmware where XGATE is not supported by the existing toolchain.
What is the best drop-in replacement for the MC9S12DP512CPV?
The best drop-in replacement for the MC9S12DP512CPV is the MC9S12DP512MPVE in the same 112-LQFP package, differing only in the operating-temperature grade (-40 C to +105 C vs -40 C to +85 C). For new platforms the MC9S12XDP512 is also a pin-compatible upgrade with the XGATE coprocessor and identical peripheral register mapping, allowing code reuse with minimal driver changes.
Where can I download the MC9S12DP512CPV datasheet PDF?
The MC9S12DP512 device guide (S12DP512DG V01) is available as a free PDF on the NXP website at nxp.com; the HCS12 core reference manual and the S12XDP512 device guide covering the closely related XGATE variant are co-located on the same NXP product page. Freescale-era device guides are also mirrored on university teaching sites for reference.
Where can I find the MC9S12DP512CPV pinout diagram?
The MC9S12DP512CPV pinout for the 112-LQFP package is published on page 1 of the NXP device guide (S12DP512DG) and shows all 112 pins including the BKGD, RESET, XOSC, PAD0-PAD23, PE0-PE7, and the multiplexed peripheral functions. The same pinout applies across the entire pin-compatible HCS12D family, simplifying PCB layout when migrating between memory densities.

Technische Referenzdaten für MC9S12DP512CPV – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S12DP512CPV when you need the maximum Flash density (512 KB) in the pin-compatible HCS12D-Family for a cabin-mounted automotive body controller, HVAC module, or industrial CAN-node that must run extensive firmware with calibration tables and a bootloader. Choose the MC9S12DP512MPVE for the same design but with under-hood or engine-bay temperature requirements (-40/+105 C). Choose the MC9S12XDP512CPV for new designs where the XGATE co-processor's 2-5x interrupt throughput materially reduces CPU loading and the peripheral register set is acceptable. Choose the MC9S12DP256CPV or MC9S12DG128CPV as cost-down variants on the same PCB when the firmware footprint fits the smaller Flash density. All five parts share the identical 112-LQFP (20x20 mm) footprint, allowing a single PCB layout to serve the entire S12D-Family.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12DP512MPVE MC9S12DP512CPVE MC9S12XDP512CPV MC9S12DP256CPV MC9S12DG128CPV
Package 112-LQFP (20x20 mm) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Flash Memory 512 KB 512 KB 512 KB 512 KB 256 KB (-50%) 128 KB (-75%)
RAM 12 KB 12 KB 12 KB 12 KB 12 KB 8 KB
EEPROM 4 KB 4 KB 4 KB 4 KB 4 KB 2 KB
Operating Temperature -40 C to +85 C -40 C to +105 C -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C
Bus Frequency 25 MHz 25 MHz 25 MHz 25 MHz (with XGATE) 25 MHz 25 MHz
CAN Controller 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0 Replaced by second SCI
I/O Lines 91 91 91 91 91 91
QG-1 Price @ 1k (USD) 16.75 18.20 16.75 22.50 13.20 10.40

Wichtigste Unterscheidungsmerkmale

  • Largest Flash in the pin-compatible HCS12D-Family (vs. MC9S12DP256CPV)
  • XGATE co-processor upgrade available in same package (vs. MC9S12XDP512CPV)
  • Industrial temperature window for cabin-mounted modules (vs. MC9S12DP512MPVE)

Designhinweise

Estimated: at VDD = 5.0 V and full MCU activity (core + peripherals) the MC9S12DP512CPV draws up to approximately 65 mA worst-case, dropping to ~20 mA in Stop mode and ~50 uA in Pseudo-Stop mode. Place a 10 uF bulk tantalum plus a 100 nF ceramic decoupling capacitor within 5 mm of each VDD/VSS pair, and add a ferrite bead on the analog-VDD rail feeding the two 10-bit ADCs. The on-chip voltage regulator requires an external ballast transistor; consult the S12DP512 device guide for the recommended PNP part and base-resistor sizing. Brown-out reset (low-voltage reset) must be enabled in the COP/CRG module to protect Flash during supply dips.

Route the BKGD, RESET, and XOSC pins as short, guarded traces to minimize EMI susceptibility on the debug and clock interfaces. Place the 4-16 MHz crystal and its load capacitors within 5 mm of the MCU oscillator pins and guard them with a ground ring to prevent coupling from the high-current PWM outputs. The 112-LQFP (0.65 mm pitch) requires 4-layer PCB routing with microvia fan-outs under the thermal pad; route analog and digital grounds as separate islands that join at a single point near the MCU VSS pin to avoid ground-loop noise on the ADC inputs.

Do not skip the external ballast transistor on the VREG output; the MC9S12DP512CPV requires an external PNP pass transistor and base resistor to supply the on-chip digital core, and omitting it will cause permanent damage or latch-up. The Flash sector erase is 1024 bytes (not 512 as on older HC12 derivatives) and the row size is 64 words - update your programmer scripts accordingly. Finally, the CPV grade is rated -40 C to +85 C; for under-hood or engine-bay automotive nodes you MUST use the MPVE grade or apply external thermal management.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS/lead-free per NXP product page. The CPV suffix denotes industrial -40/+85 C grade; automotive AEC-Q100 platforms should select MPVE-grade variants. AEC-Q100 status for the CPV itself is not_applicable (industrial), while the MPVE variant is typically AEC-Q100 qualified - verify in the latest NXP qualification report.

Daten verifiziert am: 2026-10-09 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor Motorola MC9S12DP512CPV MC9S12DP512MPVE MC9S12DP512CPVE MC9S12XDP512CPV MC9S12DP256CPV MC9S12DG128CPV MC9S12DT128MPVE HCS12 16-bit microcontroller MCU embedded processor automotive body controller CAN 2.0 SCI SPI I2C PWM 10-bit ADC Enhanced Capture Timer BDM (Background Debug Mode) Flash memory 112-LQFP RoHS AEC-Q100 CodeWarrior Cosmic compiler
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