MC9S12XA256CAL vs MC9S12H256VPVE Vergleich

Detaillierter Direktvergleich von MC9S12XA256CAL von NXP Semiconductors und MC9S12H256VPVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12XA256CAL MC9S12XA256CAL - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XA256CAL - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XA256CAL Nrnd
NXP Semiconductors
MC9S12H256VPVE MC9S12H256VPVE - 16-bit 50MHz HCS12 MCU 256KB Flash LQFP-112 | NXP

MC9S12H256VPVE - 16-bit 50MHz HCS12 MCU 256KB Flash LQFP-112 | NXP

MC9S12H256VPVE ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12XA256CAL MC9S12H256VPVE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $26,91 $17,25
Core Processor HCS12X (S12XA), 16-bit CISC —
Core Size 16-bit —
Maximum Clock Speed 80 MHz —
Program Memory Size 256 KB (256K x 8) Flash —
RAM Size [DATA_NEEDED: exact RAM size] —
Supply Voltage Range 2.35 V to 5.5 V —
I/O Count 59 —
ADC Resolution 10 bit —
Datenbusbreite 16 bit —
Gehäuse 112-LQFP (20x20 mm) 112-LQFP (20 x 20 mm)
Montageart Surface Mount (SMD/SMT, gull-wing) Surface Mount
Temperature Grade [DATA_NEEDED: operating temperature range] —
Lebenszyklusstatus NRND (Not Recommended for New Designs) per NXP —
Architecture Family S12X / HCS12X —
Program Memory Type FLASH —
RoHS-Status [DATA_NEEDED: RoHS compliance detail] Compliant
Pin-Anzahl 112 —
Core — HCS12 (16-bit)
Maximum CPU Frequency — 50 MHz
Program Flash Memory — 256 KB (256K x 8)
On-chip RAM — 12 KB
On-chip EEPROM — 4 KB
Operating Voltage — 4.5 V to 5.5 V (regulated internally to 2.5 V core)
Betriebstemperatur — -40 °C to +105 °C
CAN Modules (msCAN) — 2 x CAN 2.0A/B
SCI (UART) Modules — 2
SPI Modules — 2
IIC (I²C) Modules — 1
A/D Converter — 10-bit, 8/16 channels
Enhanced Capture Timer — 16-bit, 8 channels
PWM Channels — 8 x 8-bit or 4 x 16-bit
General-Purpose I/O — Up to 91 pins
Debug Interface — Background Debug Mode (BDM)
Low-Power Modes — STOP, PSEIP pseudofrozen

Datenblätter & Ressourcen

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