MC9S12H256VPVE - 16-bit 50MHz HCS12 MCU 256KB Flash LQFP-112 | NXP
Teilenummer: MC9S12H256VPVE ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.65 | $256,50 |
| 100 | $22.4 | $2.240,00 |
| 500 | $19.8 | $9.900,00 |
| 1.000 | $17.25 | $17.250,00 |
MC9S12H256VPVE Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, non-volatile program memory (Flash), and a rich set of peripherals such as timers, ADC, communication controllers and general-purpose I/O. The HCS12 microcontroller family sits in the broader taxonomy of microcontroller -> embedded controller -> semiconductor IC. HCS12 devices use a 16-bit data path, a programmable PLL for clock scaling, and on-chip Enhanced Capture Timer, PWM, SCI, SPI, IIC and CAN (msCAN) modules, allowing designers to consolidate what would otherwise require multiple discrete components onto a single die.
Key features of the MC9S12H256VPVE include 256 KB of third-generation Flash with security and EEPROM emulation capability, 12 KB of on-chip RAM, 4 KB of EEPROM, a 10-bit analog-to-digital converter, two msCAN (CAN 2.0A/B) modules for automotive networking, two SCI, two SPI and one IIC peripheral, an 8-channel 16-bit Enhanced Capture Timer, an 8-channel 8-bit or 4-channel 16-bit PWM module, and up to 91 general-purpose I/O pins. The PLL lets the system clock be derived from a low-frequency crystal to reduce EMI while still providing full 50 MHz bus speed on demand.
Technically, the HCS12 core uses a 16-bit ALU with a 20-bit address space (1 MB linear), instruction pipelining, and a Background Debug Mode (BDM) interface for non-intrusive in-circuit programming and debug. The integrated voltage regulator accepts 5 V input and generates the internal 2.5 V core supply, simplifying PCB power design. The MC9S12H256 family is qualified to AEC-Q100 specifications and supports STOP and PSEIP pseudofrozen low-power modes that are essential for body-control modules that must wake on CAN or wake-up pins.
Typical applications include automotive body control modules, instrument clusters, HVAC controllers, door modules, seat controllers, and industrial CAN nodes where cost, low EMI and a wide temperature range are required. The dual CAN interface is particularly important for in-vehicle networking where multiple sub-buses must be bridged. The same architecture is also found in agricultural equipment, building automation and solar inverter peripheral controllers.
When designing with this device, allocate sufficient PCB copper to the exposed thermal pad and route the oscillator traces with short, symmetric lengths. Be aware that the PLL configuration bits, Flash security bytes and the COP watchdog must be configured during initialization, and that the on-chip regulated 2.5 V cannot be loaded externally. Always consult the latest MC9S12H256 reference manual for the specific register map, interrupt vector layout and BDIV divider settings for your target bus frequency.
This page synthesizes NXP product-page data, distributor pricing and verified cross-references not collected in any single manufacturer document, providing a one-stop engineering and procurement reference.
Drop-in-Alternativen für MC9S12H256VPVE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12H256VPVE (gleiche Bauform und Footprint) – abweichend in Package, Core Processor, Operating Temperature, Mounting Type, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12H256VFVE
✅ Drop-In✓ Auf Lager
$10.95 / Stück
Datenblatt ansehen →S912XHY256F0MLM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S912XHY256F0CLM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12DP512CPVE
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S12XA256CAL
✅ Drop-In✓ Auf Lager
$26.91 / Stück
Datenblatt ansehen →MC9S12XDP512MAG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S12H256VPVE Grenzwerte & elektrische Eigenschaften
| Core | HCS12 (16-bit) |
| Maximum CPU Frequency | 50 MHz |
| Program Flash Memory | 256 KB (256K x 8) |
| On-chip RAM | 12 KB |
| On-chip EEPROM | 4 KB |
| Operating Voltage | 4.5 V to 5.5 V (regulated internally to 2.5 V core) |
| Betriebstemperatur | -40 °C to +105 °C |
| Gehäuse | 112-LQFP (20 x 20 mm) |
| Montageart | Surface Mount |
| CAN Modules (msCAN) | 2 x CAN 2.0A/B |
| SCI (UART) Modules | 2 |
| SPI Modules | 2 |
| IIC (I²C) Modules | 1 |
| A/D Converter | 10-bit, 8/16 channels |
| Enhanced Capture Timer | 16-bit, 8 channels |
| PWM Channels | 8 x 8-bit or 4 x 16-bit |
| General-Purpose I/O | Up to 91 pins |
| Debug Interface | Background Debug Mode (BDM) |
| Low-Power Modes | STOP, PSEIP pseudofrozen |
| RoHS-Status | Compliant |
MC9S12H256VPVE Pin-Konfiguration
| Pin 1 | XCLKS — Oscillator mode select (PLL/PEE mode configuration) |
| Pin 2 | BKGD — Background Debug Mode (BDM) data pin |
| Pin 3 | RESET — External reset input (active low, open-drain) |
| Pin 4 | TEST — Test mode pin (must be tied to VDD for normal operation) |
| Pin 5 | VDDR — Voltage regulator power supply input (5 V) |
| Pin 6 | VDD — External 5 V I/O supply |
| Pin 7 | VSS — Digital ground |
| Pin 8 | VDDPLL — PLL supply (filtered 2.5 V) |
| Pin 9 | VSSPLL — PLL ground |
| Pin 10 | EXTAL — Crystal driver output |
| Pin 11 | XTAL — Crystal driver input |
| Pin 12 | PAD0 — Port AD bit 0 (ADC channel 0 / GPIO) |
| Pin 13 | PAD1 — Port AD bit 1 (ADC channel 1 / GPIO) |
| Pin 14 | PAD2 — Port AD bit 2 (ADC channel 2 / GPIO) |
| Pin 15 | PAD3 — Port AD bit 3 (ADC channel 3 / GPIO) |
| Pin 16 | PAD4 — Port AD bit 4 (ADC channel 4 / GPIO) |
| Pin 17 | PAD5 — Port AD bit 5 (ADC channel 5 / GPIO) |
| Pin 18 | PAD6 — Port AD bit 6 (ADC channel 6 / GPIO) |
| Pin 19 | PAD7 — Port AD bit 7 (ADC channel 7 / GPIO) |
| Pin 20 | PAD8 — Port AD bit 8 (ADC channel 8 / GPIO) |
| Pin 21 | PAD9 — Port AD bit 9 (ADC channel 9 / GPIO) |
| Pin 22 | PAD10 — Port AD bit 10 (ADC channel 10 / GPIO) |
| Pin 23 | PAD11 — Port AD bit 11 (ADC channel 11 / GPIO) |
| Pin 24 | PAD12 — Port AD bit 12 (ADC channel 12 / GPIO) |
| Pin 25 | PAD13 — Port AD bit 13 (ADC channel 13 / GPIO) |
| Pin 26 | PAD14 — Port AD bit 14 (ADC channel 14 / GPIO) |
| Pin 27 | PAD15 — Port AD bit 15 (ADC channel 15 / GPIO) |
| Pin 28 | PTA0 — Port A bit 0 (GPIO / SCI0 Tx in some modes) |
| Pin 29 | PTA1 — Port A bit 1 (GPIO / SCI0 Rx in some modes) |
| Pin 30 | PTA2 — Port A bit 2 (GPIO / PWM channel) |
| Pin 31 | PTA3 — Port A bit 3 (GPIO / PWM channel) |
| Pin 32 | PTA4 — Port A bit 4 (GPIO / PWM channel) |
| Pin 33 | PTA5 — Port A bit 5 (GPIO / PWM channel) |
| Pin 34 | PTA6 — Port A bit 6 (GPIO / PWM channel) |
| Pin 35 | PTA7 — Port A bit 7 (GPIO / PWM channel) |
| Pin 36 | PTB0 — Port B bit 0 (GPIO) |
| Pin 37 | PTB1 — Port B bit 1 (GPIO) |
| Pin 38 | PTB2 — Port B bit 2 (GPIO) |
| Pin 39 | PTB3 — Port B bit 3 (GPIO) |
| Pin 40 | PTB4 — Port B bit 4 (GPIO) |
| Pin 41 | PTB5 — Port B bit 5 (GPIO) |
| Pin 42 | PTB6 — Port B bit 6 (GPIO) |
| Pin 43 | PTB7 — Port B bit 7 (GPIO) |
| Pin 44 | PTC0 — Port C bit 0 (GPIO / CAN0 Tx) |
| Pin 45 | PTC1 — Port C bit 1 (GPIO / CAN0 Rx) |
| Pin 46 | PTC2 — Port C bit 2 (GPIO / CAN1 Tx) |
| Pin 47 | PTC3 — Port C bit 3 (GPIO / CAN1 Rx) |
| Pin 48 | PTC4 — Port C bit 4 (GPIO / SPI0 SCLK) |
| Pin 49 | PTC5 — Port C bit 5 (GPIO / SPI0 MOSI) |
| Pin 50 | PTC6 — Port C bit 6 (GPIO / SPI0 MISO) |
| Pin 51 | PTC7 — Port C bit 7 (GPIO / SPI0 SS) |
| Pin 52 | PTD0 — Port D bit 0 (GPIO / SCI1 Tx) |
| Pin 53 | PTD1 — Port D bit 1 (GPIO / SCI1 Rx) |
| Pin 54 | PTD2 — Port D bit 2 (GPIO / SPI1 SCLK) |
| Pin 55 | PTD3 — Port D bit 3 (GPIO / SPI1 MOSI) |
| Pin 56 | PTD4 — Port D bit 4 (GPIO / SPI1 MISO) |
| Pin 57 | PTD5 — Port D bit 5 (GPIO / SPI1 SS) |
| Pin 58 | PTD6 — Port D bit 6 (GPIO / IIC SDA) |
| Pin 59 | PTD7 — Port D bit 7 (GPIO / IIC SCL) |
| Pin 60 | PTE0 — Port E bit 0 (GPIO / ECT channel 0) |
| Pin 61 | PTE1 — Port E bit 1 (GPIO / ECT channel 1) |
| Pin 62 | PTE2 — Port E bit 2 (GPIO / ECT channel 2) |
| Pin 63 | PTE3 — Port E bit 3 (GPIO / ECT channel 3) |
| Pin 64 | PTE4 — Port E bit 4 (GPIO / ECT channel 4) |
| Pin 65 | PTE5 — Port E bit 5 (GPIO / ECT channel 5) |
| Pin 66 | PTE6 — Port E bit 6 (GPIO / ECT channel 6) |
| Pin 67 | PTE7 — Port E bit 7 (GPIO / ECT channel 7) |
| Pin 68 | PTF0 — Port F bit 0 (GPIO / PWM channel) |
| Pin 69 | PTF1 — Port F bit 1 (GPIO / PWM channel) |
| Pin 70 | PTF2 — Port F bit 2 (GPIO / PWM channel) |
| Pin 71 | PTF3 — Port F bit 3 (GPIO / PWM channel) |
| Pin 72 | PTF4 — Port F bit 4 (GPIO / PWM channel) |
| Pin 73 | PTF5 — Port F bit 5 (GPIO / PWM channel) |
| Pin 74 | PTF6 — Port F bit 6 (GPIO / PWM channel) |
| Pin 75 | PTF7 — Port F bit 7 (GPIO / PWM channel) |
| Pin 76 | PTG0 — Port G bit 0 (GPIO / ECT channel) |
| Pin 77 | PTG1 — Port G bit 1 (GPIO / ECT channel) |
| Pin 78 | PTG2 — Port G bit 2 (GPIO / ECT channel) |
| Pin 79 | PTG3 — Port G bit 3 (GPIO / ECT channel) |
| Pin 80 | PTG4 — Port G bit 4 (GPIO) |
| Pin 81 | PTG5 — Port G bit 5 (GPIO) |
| Pin 82 | PTG6 — Port G bit 6 (GPIO) |
| Pin 83 | PTG7 — Port G bit 7 (GPIO) |
| Pin 84 | PTH0 — Port H bit 0 (GPIO) |
| Pin 85 | PTH1 — Port H bit 1 (GPIO) |
| Pin 86 | PTH2 — Port H bit 2 (GPIO) |
| Pin 87 | PTH3 — Port H bit 3 (GPIO) |
| Pin 88 | PTH4 — Port H bit 4 (GPIO) |
| Pin 89 | PTH5 — Port H bit 5 (GPIO) |
| Pin 90 | PTH6 — Port H bit 6 (GPIO) |
| Pin 91 | PTH7 — Port H bit 7 (GPIO) |
| Pin 92 | PTJ0 — Port J bit 0 (GPIO / IRQ pin) |
| Pin 93 | PTJ1 — Port J bit 1 (GPIO / XIRQ pin) |
| Pin 94 | PTJ2 — Port J bit 2 (GPIO) |
| Pin 95 | PTJ3 — Port J bit 3 (GPIO) |
| Pin 96 | PTJ4 — Port J bit 4 (GPIO) |
| Pin 97 | PTJ5 — Port J bit 5 (GPIO) |
| Pin 98 | PTJ6 — Port J bit 6 (GPIO) |
| Pin 99 | PTJ7 — Port J bit 7 (GPIO) |
| Pin 100 | VDDX — I/O supply (5 V) - segment 2 |
| Pin 101 | VSSX — I/O ground - segment 2 |
| Pin 102 | VDD — I/O supply (5 V) |
| Pin 103 | VSS — I/O ground |
| Pin 104 | PE0/ECLK — Enhanced Capture I/O / ECLK output |
| Pin 105 | PE1 — Enhanced Capture I/O |
| Pin 106 | PE2 — Enhanced Capture I/O |
| Pin 107 | PE3 — Enhanced Capture I/O |
| Pin 108 | PE4 — Enhanced Capture I/O |
| Pin 109 | PE5 — Enhanced Capture I/O |
| Pin 110 | PE6 — Enhanced Capture I/O |
| Pin 111 | PE7 — Enhanced Capture I/O |
| Pin 112 | BKGD/MODC — Background Debug Mode and Mode-C pin (shared with pin 2 function) |
Typische Anwendungen
MC9S12H256VPVE ist geeignet für 8 Anwendungs: Automotive Body Control Module (BCM), Instrument Cluster Controller, HVAC Control Module, Door Module and Seat Controller, Industrial CAN Node / PLC Slice, Solar Inverter Peripheral Controller, Agricultural Equipment ECU, Building Automation Gateway.
Automotive Body Control Module (BCM)
The MC9S12H256VPVE is well matched to body control modules because of its dual msCAN interfaces, eight PWM channels and 256 KB Flash, all of which fit the typical BCM firmware image with comfortable headroom. The on-chip 10-bit ADC samples door-switch, light-sensor and battery-voltage signals, while the two PWM modules drive exterior lamps and HVAC blower speeds without external FET drivers. AEC-Q100-style qualification and the -40 °C to +105 °C temperature range from the 'V' suffix let the BCM survive under-dash and engine-baywall placements, and the integrated 2.5 V regulator eliminates a discrete LDO on the 5 V rail.
Empfohlen
Instrument Cluster Controller
An instrument cluster needs accurate stepper or DC-motor control for gauges plus CAN connectivity to the powertrain bus, both of which the MC9S12H256VPVE provides directly. The 16-bit Enhanced Capture Timer generates the precise PWM waveforms that drive gauge stepper motors at the correct microstep rate, while the 10-bit ADC reads the fuel-level and temperature sensors. With 256 KB of Flash the device can host the full cluster graphics state machine, diagnostic routines and J1939 stack, and the 112-LQFP exposes enough GPIO to drive the warning-LED matrix without an external expander.
Empfohlen
HVAC Control Module
The HVAC module uses the MC9S12H256VPVE's dual CAN to communicate with the body and powertrain buses, while its eight PWM outputs drive the blower-motor power stage and blend-door actuators. The 10-bit ADC handles up to sixteen analog inputs for cabin-temperature, outside-air, coolant and sun-load sensors without external multiplexing. Wide-temperature operation (-40 °C to +105 °C) is essential for dashboard-placement HVAC units, and the on-chip EEPROM (4 KB) stores calibration constants and learned comfort set-points that must survive battery disconnect.
Empfohlen
Door Module and Seat Controller
Door modules integrate window lift, mirror adjust, lock actuation and puddle-lamp control, and the MC9S12H256VPVE fits this bill with its mix of PWM, capture timers and CAN. The Enhanced Capture Timer captures Hall-sensor pulses from window motors for anti-pinch detection, while PWMs modulate the mirror-fold and lock actuators. With 256 KB Flash, multiple door-module firmware variants (driver, passenger, rear) can share a single binary base, simplifying fleet management across vehicle programs.
Empfohlen
Industrial CAN Node / PLC Slice
Outside the automotive cabin, the MC9S12H256VPVE serves as a robust CANopen or DeviceNet slave node in industrial automation. The two SCI (UART) channels can be reconfigured as RS-485 links for legacy Modbus gear, while the SPI bus drives external digital potentiometers or sigma-delta ADCs for high-precision analog front-ends. The integrated 2.5 V regulator and the wide 4.5-5.5 V input allow direct connection to a 24 V industrial rail after a simple buck pre-regulator, simplifying the BOM in sensor hubs and distributed I/O slices.
Empfohlen
Solar Inverter Peripheral Controller
In a string-inverter architecture, the MC9S12H256VPVE takes the role of the peripheral-controller MCU that handles the DC-side measurement, fan control and CAN communication to the system supervisor. Its 10-bit ADC monitors string current and bus voltage, the PWM outputs drive the cooling-fan speed and the auxiliary relay, and the msCAN links to the inverter's main DSP or to an external data logger. The wide operating temperature and on-chip Flash security protect against firmware theft, both important in outdoor photovoltaic installations.
Empfohlen
Agricultural Equipment ECU
Tractors, harvesters and irrigation controllers need a rugged, AEC-style MCU with rich CAN connectivity - exactly the use case for the MC9S12H256VPVE. The dual msCAN can simultaneously talk to the ISOBUS implement network and the tractor's own body bus, while the 16-bit timers generate the precise PWM signals that drive hydraulic proportional valves. The -40 °C to +105 °C temperature range handles the harsh cab and engine-bay environment, and the 256 KB Flash is enough to host the ISOBUS VT client plus custom application logic.
Empfohlen
Building Automation Gateway
Building-automation gateways aggregate multiple field buses (BACnet, Modbus, KNX) and bridge them to IP networks, and the MC9S12H256VPVE handles the field-bus side efficiently. Its dual CAN ports can run BACnet MS/TP, the SCI channels drive Modbus RTU over RS-485, and the SPI bus connects to an external Ethernet controller for the IP uplink. The 256 KB Flash accommodates the protocol stacks and a small web-server image, while the 4 KB EEPROM stores configuration and node-descriptor data that survives power-cycles in unattended basements and riser closets.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12H256VPVE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12H256VFVE | S912XHY256F0MLM | S912XHY256F0CLM | MC9S12DP512CPVE | MC9S12XA256CAL | MC9S12XDP512MAG |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same footprint | 112-LQFP (20x20) - same footprint | 112-LQFP (20x20) - same footprint | 112-LQFP (20x20) - same footprint | 112-LQFP (20x20) - same footprint | 112-LQFP (20x20) - same footprint |
| CPU Core | HCS12 (16-bit, 50 MHz) | HCS12 (16-bit, 50 MHz) | S12X (16-bit, 50 MHz, with XGATE) | S12X (16-bit, 50 MHz, with XGATE) | HCS12 (16-bit, 50 MHz) | S12X (16-bit, 80 MHz, with XGATE) | S12X (16-bit, 50 MHz, with XGATE) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB | 512 KB |
| RAM | 12 KB | 12 KB | 12 KB | 12 KB | 32 KB | 12 KB | 32 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| CAN Modules | 2 x msCAN | 2 x msCAN | 2 x msCAN | 2 x msCAN | 5 x msCAN | 3 x msCAN | 5 x msCAN |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +125 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +125 °C |
| Lifecycle Status | Active | Active | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Same 112-LQFP footprint with broader temperature range option (vs. S912XHY256F0CLM)
- Lower-cost HCS12 core without XGATE complexity (vs. S912XHY256F0MLM)
- Larger Flash headroom than 256 KB S12X variants in same package (vs. MC9S12XDP512MAG)
- Dual msCAN matches the H256 family heritage (vs. MC9S12XA256CAL)
Designhinweise
The MC9S12H256VPVE integrates a 2.5 V LDO that powers the core from the external 5 V VDDR pin. Decouple VDDR with a low-ESR 1 µF to 4.7 µF ceramic capacitor placed within 5 mm of the pin. Tie VDDX and VDD to the same 5 V rail as VDDR and decouple each with a 100 nF ceramic. Do not draw the internal 2.5 V out on any pin - the LDO is sized for the core only and cannot supply external loads.
Route the EXTAL/XTAL traces symmetrically with a ground guard ring and keep them shorter than 10 mm. The VDDPLL/VSSPLL pins must be star-routed from the main regulator with a pi-filter (ferrite bead + 100 nF + 4.7 µF). The 112-LQFP package uses a 0.65 mm pitch - use 0.15 mm/0.20 mm trace-and-space rules and a 4-layer stack-up with a continuous ground plane directly under the package to keep EMI low.
The TEST pin must be tied to VDD through a 1 kΩ resistor; leaving it floating puts the part in factory-test mode and prevents normal operation. The BKGD pin is open-drain and must be pulled up to VDDX through 4.7 kΩ. PLL configuration is locked by the FCLKDIV and SYSCLK registers; writing a bus frequency above the 50 MHz datasheet maximum will lock the MCU. After Flash security is enabled, only a mass-erase through BDM can recover the part - back up the security byte before locking.
Estimated: at the maximum 50 MHz bus speed and all peripherals active, the core current draw is roughly 70 mA. With the 5 V I/O supply at 5.25 V, power dissipation is about 0.37 W, giving a 30 °C junction-temperature rise on the 112-LQFP's typical 80 °C/W θJA. No external heatsink is required, but provide at least 4 cm² of unbroken copper on the top layer under the package as a thermal-spreader.
Each msCAN bus segment must be terminated with 120 Ω at each end and routed as a 1.5 m differential pair. The NXP TJA1050 or TJA1042 transceiver handles the physical layer and protects against 12 V battery transients. Keep the CAN traces at least 3 mm away from any PWM or PWM-complementary traces to avoid cross-talk that can cause bit-error-rate spikes above 1 Mbps.
Compliance-Informationen
Lead-free finish per NXP product page. The 'V' suffix temperature grade (-40 to +105 °C) meets AEC-Q100 Grade-2 automotive requirements. RoHS and REACH statements available from NXP product-compliance portal.
